NXP Semiconductors has released its first medium-power Schottky rectifier PMEG45T15EPD with Trench technology in CFP15 (SOT1289) FlatPower package. Due to the Trench process, the new type offers a very low reverse current of only 30µA. The voltage drop value remains about the same compared to planar types. Furthermore, it delivers a reverse voltage of 45V and an average forward current of 15A. Key applications include: high-efficiency dc-dc conversion, switch mode power supplies, freewheeling applications, reverse polarity protection, and various applications that demand low-power consumption.
The rectifier is housed in an ultra-thin CFP15 package, with a package height of only 0.78mm, integrated clip-bond technology and a large heat sink. It is capable of temperatures up to 150 degrees C. This makes it highly-suitable for applications such as high-efficiency low-power adapter, especially at high operating temperatures.
The new Trench type expands the earlier released planar portfolio of medium-power Schottky rectifiers in CFP15. The expansion of NXP’s porfolio will continue with the release the first automotive qualified Trench type in September.
Key features and benefits include: Average forward current: IF(AV) ≤ 15 A; Reverse voltage: VR ≤ 45 V; Low forward voltage, VF typ = 480 µA (at 15 A); Low leakage current, IR typ = 30 µA (at 45 V) due to Trench MEGA Schottky technology; High-power capability due to clip-bonding technology and heat sink; and Small and thin SMD power plastic package, typical height 0.78 mm.
