Toshiba Ultra-Miniature Isolated Couplers Drive IGBTs/MOSFETs at Higher Temperatures

Two new ultra-miniature IGBT/MOSFET Gate drive photocouplers, which are said to offer ’guaranteed’ performance at temperatures ranging from -40 to 125°C, have been introduced by Toshiba Electronics Europe (TEE).

The TLP700H and TLP701H are supplied in SDIP6 packaging and are designed to directly drive IGBTs and power MOSFETs without the need for additional components. Target applications include digital consumer products, test and measurement equipment, industrial control systems and induction heating.

Maximum peak output current ratings are ±2A for the TLP700H and ±0.6A for the TLP701H. Despite their size (mounting area is just half that of a DIP8 package) each device offers a minimum withstand voltage of 5000Vrms. This allows designers to address the reinforced isolation requirements demanded for international safety certification.

The TLP700H and TLP701H couplers feature buffer logic type totem pole outputs and incorporate internal noise shields to provide minimum guaranteed common mode transient immunities of ±20kV/µs and ±15kV/µs respectively. Low maximum supply currents – 3mA for the TLP700H and 2mA in the case of the TLP701H – help to keep power consumption to a minimum.

With wide power supply input ranges of 15 to 30V (TLP700H) and 10 to 30V (TLP701H) the new couplers enhance design flexibility and lower component count by minimising the need for power conversion circuitry. Respective maximum switching times of 500ns and 700ns ensure that the devices meet the IGBT/MOSFET drive performance demands of a wide variety of target applications.

Both of the photocouplers comprise Toshiba’s latest GaAlAs infrared LED technology, coupled to a high-speed photodetector IC. The SDIP6 package has a height of just 4mm and a board mounting footprint of only 9.7 x 4.58mm.