TAEC Announces TSSOP Advance Packaging Technology
Toshiba America Electronic Components Inc. (TAEC, Japan and Irvine, CA) announced its TSSOP Advance, a new smaller packaging technology that extends the company's packaging options for power MOSFETs. Developed by Toshiba Corp. (Toshiba), the TSSOP Advance package is approximately 53% thinner, at 0.75 mm (typical), and requires approximately 45% smaller mounting area than industry-standard SOP-8 packages.
The first device offered in the new TSSOP Advance packaging is the Toshiba TPCM8001-H, a 30 V, 20 A power MOSFET targeted for space-constrained, synchronous rectification applications in dc-dc converters and in power supplies for mobile computers and portable electronics equipment. The TSSOP Advance packaging has a compact 3.6 mm x 4.6 mm footprint area and uses flat, lead-free Finish1 terminals connected to a spreader to improve thermal resistance, reduce package resistance loss and enable higher current output.
Samples of the TPCM8001-H 30V TSSOP Advance power MOSFET are available now, priced at $0.45 each. Production quantities are scheduled for availability in January 2005.
