Microsemi Launches New Line of IGBT 3-Phrase Bridge Modules In Compact SP3 Packages

Microsemi Corp. has introduced a new line of standard IGBT 3-phase bridge power modules in the compact SP3 package. Designed for motor control applications, the new power modules feature a 3-Phase IGBT bridge using fast NPT IGBTs for 20 to 50 KHz high frequency applications and Trench Field Stop IGBTs for 5 to 20 KHz low frequency applications.

All the new modules feature integrated sensors to monitor the module case temperature for over-temperature protection. Current ratings are in the range of 30A to 50A for 600V and 15 to 25A for 1200V fast NPT IGBTs; and 20A to 75A for 600V and 25A to 35A for 1200V Trench Field Stop IGBTs.

With a 12mm profile and a 40.8mm x 73.4mm footprint, the SP3 isolated package is claimed to provide a very compact power solution. Their solderable terminals are easily mounted to a PCB. In addition to the main dc supply connections, these products offer extra dc supply pins to connect a decoupling capacitor. Combined with their low parasitic internal inductance, this solution is said to reduce over-voltage, minimize noise, and improve operation safety.

While the new standard modules are designed for industrial applications, they are easily upgraded to withstand more severe environmental conditions, like those in aerospace applications. An aluminium nitride substrate can replace standard alumina for improved thermal performance; SiC diodes can replace FREDs for improved switching losses or increased operating frequency or temperature; an Aluminium Silicon Carbide (AlSiC) base plate can replace the standard copper base plate for reduced weight and extended lifetime against wide temperature cycles. Packaging can be enhanced to withstand temperature ranges as low as -60°C.

Samples are available immediately. Production prices in quantities of 1,000 to 5,000 pieces range from $14.75 to $36.17.