IXYS Announces Low Rdson 600V MOSFET In ISOPLUS Packages

IXYS Corp. announced the expansion of its super junction COOLMOS® CP series. The new MOSFETs are integrated in the IXYS ISOPLUS™ package. The ISOPLUS technology gives the designer a standard discrete housing with ceramic, Direct Copper Bonded (DCB) isolation. This isolation is said to have low thermal impedance and higher reliability in power cycling than standard copper based non isolated products.

The IXKC15N60C5 (600V, 0.165Ω), IXKC19N60C5 (600V, 0.125Ω) and the IXKC23N60C5 (600V, 0.1Ω) in the ISOPLUS220™ and the IXKR47N60C5 (600V, 0.045Ω) in the ISOPLUS247 are just a few examples of low Rdson MOSFETs in isolated packages. Even a dual COOLMOS LKK47-06C5 (600V, 2 x 0.045Ω) ISOPLUS264™ package is available.

The company claims that the combination with the COOLMOS CP MOSFET series and the ISOPLUS packaging is creating a high power density and reliable design which helps to reduce total system cost.