Diotec Introduces Slim Profile Green Rectifier to Help Save Board Space
Diotec Semiconductor introduced a new low profile SMD bridge rectifier in the popular outline TO-269AA ("MiniDIL"), called the S40 through S500 "SLIM" series. Their encapsulation is made by a halogen-free, "green" molding compound. Its maximum height of 1.6mm allows designers to put the device on the bottom side of the PCB, where so far only thin passives were placed.
According to Diotec, comparable bridges in the same package had up to now a height of 2.5mm, making it impossible for bottom side placement. However, the top side of most PCB designs is already quite full equipped with transformers and capacitors. Placing the bridge "downsides" helps to save a lot of board space, making devices smaller, lighter and also less expensive. The body size (4.7 x 3.9mm) and the pitch between the leads (2.54mm) remains like given in the TO-269AA industry standard.
The S40 through S500 "SLIM" series is said to offer a superior forward surge current rating of 40A, compared to maximum 30A of competitive devices. Thus they are more robust and need less effort for inrush limitation. The products are rated at true 0.8A, with the forward voltage VF specified at 0.8A in the data sheet and fully tested in production. The bridge is assembled using Diotec’s proprietary "QuattroChip" die assembly process – meaning all 4 dice are aligned, which results in an optimized thermal contact and resistance. The Plasma EPOS chip passivation allows for reverse voltages from 80 (S40) up to 1000V (S500).