EEPower

Advanced DC-DC Converters and Power Components Featured on Day Three of Electronica 2012


New Products Nov 14, 2012 by Power Pulse1595211359

On the third day of Electronica 2012, a 100W sixteenth-brick dc-dc converter was announced by Murata Power Solutions, VPT introduced a dual-output 5W converter for military applications, AVX Corp. added a new series of Schottky rectifiers packaged as lead-less chips, KEMET Corp. revealed its KEMET Power Solutions (KPS) high-voltage stacked capacitors in X7R dielectric, and Microsemi Corp. expanded its offering with a family of 1,200V Silicon-Carbide (SiC) Schottky diodes.

Murata today announced the ULS series of 100 Watt fully regulated dc-dc converters designed for use in distributed or intermediate bus power architectures. Delivering up to 100 W from an industry standard 1/16 brick package opens new design opportunities for power engineers needing to maximize power density where board space and efficiency are top priorities.

The ULS series delivers efficiencies up to 92% on the 12Vout model and 91% on the 3.3 and 5Vout models. Within the ULS series, three single-output models are available including 3.3, 5, or 12 Vdc outputs. The standard features include an input voltage range of 36-75V, meeting the insulation requirements of EN60950 - up to 2250VDC, remote on/off control, over temperature protection, over current protection, input under voltage protection. The output can be trimmed up or down by 10% in order to make up for load losses or to suit special application requirements. The modules include output voltage sense pins that maintain output regulation to within ±0.2% across all input line and load conditions. The modules are offered in either thru-hole or SMT versions and are rated for operation from -40°C to 85°C. Pricing at 1,000 pieces is ranges from $23.00 to $25.00, depending on the model.

VPT added the new VPT5 Dual series dc-dc converter designed to power electronics in unmanned vehicles, ships, armored ground vehicles, and other rugged military or hi-rel systems. The VPT5-2800D dc-dc converter delivers up to 5 watts from a small footprint of approximately one square inch, meets several military standards, and features a six-sided metal package for excellent EMI shielding. Features include: Up to 5W output power; Dual outputs of ±5V, ±12V and ±15V; -55°C to +100°C; Wide 15-50 input voltage range with 80V transient; Size 1.110" x 1.110" x 0.4"/weight 22g; Part of VPT's line of Hi-Rel MIL-COTS converters and filters; And environmental screening to JESD-22, MIL-STD-810, MIL-STD-883

AVX's new Schottky rectifiers eliminate the standard lead frame wire bond provides the chip with top-bottom symmetry, which enables better heat transfer, better current handling capability than SOD devices, and fewer mounting problems. Available in several case sizes and a range of current values spanning 0.1A to 8A, the new lead-less chip form Schottky rectifier diodes are ideal for applications including switch mode power supplies, high frequency rectification, portable battery powered devices, and reverse bias protection.

"A complement to the recent extension of AVX's inductor lines, the new Schottky barrier rectifier diodes allow us to provide solutions for all of the major passives needs of switching power supply designers," said Mike Muir, North American product manager for circuit protection products at AVX.

AVX's low power loss, high efficiency Schottky rectifier diodes are lead-free, halogen-free, and RoHS compliant. Housed in cases composed of FRP substrates with epoxy underfill, a UL 94V-0 class package material, the diodes are available in 0603, 0805, 1206, 2010, 2114, and 3220 cases sizes and in both standard and thin thicknesses. Mechanically robust, the new Schottky diodes are also available in a range of voltages, spanning 20V to 200V, and in both standard and low Vf. The diodes' terminations are 100% tin-plated and are solderable per MIL-STD-750, method 2026.

The KPS Series High Voltage devices from KEMET utilize a proprietary lead-frame technology to vertically stack one or two multilayer ceramic chip capacitors (MLCCs) into a single compact surface mount package. The two-chip vertically stacked device offers up to double the capacitance in the same or smaller design footprint, allowing for both component and board space reductions. These devices are designed for use in applications such as switching power supply smoothing circuits, snubbers in lighting ballasts circuits, and high-voltage coupling/dc blocking in inverters.

"KEMET now offers some of the highest CV values available in a 2220 footprint," stated Craig Scruggs, KEMET Specialty Ceramics Product Manager. "These high voltage bulk capacitance devices are available in rated voltages of 500 VDC and 630 VDC, have lower ESR and ESL properties than competitive technologies, and present optimization and downsizing opportunities of existing high voltage designs. We are very pleased with the response it is receiving at Electronica," continued Scruggs.

With an operating temperature range of -55°C to +125°C, KPS Series devices provide superior flex performance over traditional surface mount MLCCs with board flex capability up to 10 mm. The lead-frame isolates the capacitors from the printed circuit board, thereby providing advanced mechanical and thermal stress performance and addressing concerns for audible microphonic noise that may occur when a bias voltage is applied. They are also environmentally friendly, capable of Pb-free reflow profiles and are available in both Commercial and Automotive Grades. KPS Series Automotive Grade capacitors meet the demanding Automotive Electronics Council's AEC-Q200 qualification requirements.

The new family of 1200V SiC Schottky diodes from Microsemi are targeted at a wide range of industrial applications including solar inverters, welding, plasma cutters, fast vehicle charging, oil exploration, and other high power, high voltage applications where power density, higher performance and reliability are important. In addition to the inherent benefits of the device, Microsemi is the only manufacturer to offer a SiC Schottky diode in a large surface mount backside solderable D(3 )package allowing designers to achieve increased power density and lower manufacturing costs.

"We applied our more than 25 years of power semiconductor device design and manufacturing know-how to deliver a family of SiC diodes that offers unparalleled levels of performance, reliability and overall quality," said Russell Crecraft, general manager of Microsemi's Power Products Group. "Next-generation power conversion systems require higher power densities, higher operating frequencies and higher efficiencies--and our new silicon carbide devices help system designers meet those needs."

The new 1200V SiC Schottky diode product portfolio includes: APT10SCD120BCT (1200V, 10A, common cathode TO-247 package); APT20SCD120B (1200V, 20A, TO-247 package); APT30SCD120B (1200V, 30A, TO-247 package); APT20SCD120S (1200V, 20A, D(3) package); and APT30SCD120S (1200V, 30A, D(3)package). Microsemi's new SiC Schottky diodes are in production now.