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Highly-Integrated 225 Degrees C Isolated Gate Driver for SiC Power Switches

Highly-Integrated 225 Degrees C Isolated Gate Driver for SiC Power Switches

Mitsubishi to Launch Railcar Traction Inverter with All-SiC Power Module

Mitsubishi to Launch Railcar Traction Inverter with All-SiC Power Module

High-Temperature SiC Junction Transistors in Hermetic Packages

High-Temperature SiC Junction Transistors in Hermetic Packages

Monolithic DC-DC Drives 1A Load with no External Transistor Needed

Monolithic DC-DC Drives 1A Load with no External Transistor Needed

Split-Output Topology Improves Dynamic Behavior in SiC MOSFET Modules

Split-Output Topology Improves Dynamic Behavior in SiC MOSFET Modules

Transphorm and Fujitsu to Integrate GaN Power Device Businesses

Transphorm and Fujitsu to Integrate GaN Power Device Businesses


News Dec 01, 2013 by Jeff Shepard
Soraa Expands Its GaN-on-GaN Manufacturing Operations In U.S.

Soraa Expands Its GaN-on-GaN Manufacturing Operations In U.S.


News Nov 20, 2013 by Jeff Shepard
SiC Schottky Diodes in SMB (DO-214) packages offer smallest footprints

SiC Schottky Diodes in SMB (DO-214) packages offer smallest footprints

Transphorm’s 600V GaN Power Conversion Adopted by Delta Electronics

Transphorm’s 600V GaN Power Conversion Adopted by Delta Electronics


News Nov 13, 2013 by Jeff Shepard
Silicon Carbide Bare Die up to 8000V from GeneSiC

Silicon Carbide Bare Die up to 8000V from GeneSiC

Monolithic Power Aims for Si / SiC Cost Parity within 4 Years

Monolithic Power Aims for Si / SiC Cost Parity within 4 Years


News Nov 04, 2013 by Jeff Shepard
Kyma Technologies Selected by ARPA-E for GaN Substrate Development

Kyma Technologies Selected by ARPA-E for GaN Substrate Development


News Nov 03, 2013 by Jeff Shepard
Avogy Gets Multiple DOE Awards to Develop Vertical GaN Transistors

Avogy Gets Multiple DOE Awards to Develop Vertical GaN Transistors


News Nov 03, 2013 by Jeff Shepard
Anvil Drops the Hammer on £1m to Develop Low-Cost SiC Power Devices

Anvil Drops the Hammer on £1m to Develop Low-Cost SiC Power Devices


News Oct 31, 2013 by Jeff Shepard
Toshiba Adds Lower-Current Devices to SiC Schottky Offering

Toshiba Adds Lower-Current Devices to SiC Schottky Offering

Soraa Gets More DOE Funding For Development of Bulk GaN Substrates

Soraa Gets More DOE Funding For Development of Bulk GaN Substrates


News Oct 22, 2013 by Jeff Shepard
650V SiC Schottky Improves Performance in High-power Industrial Applications

650V SiC Schottky Improves Performance in High-power Industrial Applications

GaN Systems appoints Vqdot as Applications Development Partner

GaN Systems appoints Vqdot as Applications Development Partner


News Oct 07, 2013 by Jeff Shepard
EPC Dev. Board Features Optimal Layout of Paralleled GaN FETs for Higher Currents

EPC Dev. Board Features Optimal Layout of Paralleled GaN FETs for Higher Currents

Showa Denko to launch 6-inch SiC Epitaxial Wafers for Power Devices

Showa Denko to launch 6-inch SiC Epitaxial Wafers for Power Devices


News Sep 29, 2013 by Jeff Shepard