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Dual-Mode IC Supports Bluetooth Classic and LE 4.2

Dual-Mode IC Supports Bluetooth Classic and LE 4.2

Swatch Claims the World’s Smallest Bluetooth Chip

Swatch Claims the World’s Smallest Bluetooth Chip


News Mar 05, 2017 by Jeff Shepard
Opening of Blacksburg Virginia eGaN FET and IC Applications Center

Opening of Blacksburg Virginia eGaN FET and IC Applications Center

Efficient Power Conversion Corporation (EPC) is proud to announce the opening of an Applications Center in Blacksburg, Virginia.  


new products Mar 03, 2017 by EPC
High Voltage Ceramic Chip Capacitors Evaluated Acoustically

High Voltage Ceramic Chip Capacitors Evaluated Acoustically

This article discusses how acoustic micro imaging tools work and how it helps detect and keep defective capacitors out of production.


SOI Wafer is a Suitable Substrate for GaN Crystals

SOI Wafer is a Suitable Substrate for GaN Crystals


News Mar 02, 2017 by Jeff Shepard
Ag-Sintering as an Enabler for Thermally Demanding Electronic and Semiconductor Applications

Ag-Sintering as an Enabler for Thermally Demanding Electronic and Semiconductor Applications

This article highlights Advanced Packaging Center and Alpha Assembly Solutions Silver (Ag) sintering proven and reliable bonding technology for…


1200V 75mOhm SiC FET in Low-Inductance Package

1200V 75mOhm SiC FET in Low-Inductance Package

The Creation and Potential Cell Structures of SiC Devices

The Creation and Potential Cell Structures of SiC Devices

> <p>This article highlights ROHM about the potential structures of SiC devices, focusing on different structures and showing that…


Pilot Production Coming for High-Performance PV Silicon

Pilot Production Coming for High-Performance PV Silicon


News Feb 20, 2017 by Jeff Shepard
Integrated Half-Bridge GaN Power IC

Integrated Half-Bridge GaN Power IC

160W and 375W DC-DCs in 0.29” High ChiP Packaging

160W and 375W DC-DCs in 0.29” High ChiP Packaging

Automotive Three-Phase Isolated MOSFET Driver IC

Automotive Three-Phase Isolated MOSFET Driver IC

Unidirectional Linear Hall Sensor IC in Surface-Mount Package

Unidirectional Linear Hall Sensor IC in Surface-Mount Package

This article features Allegro Microsystems' ALS31000, a unidirectional linear Hall sensor integrated circuit for automotive and industrial…


Unidirectional ESD Protection in 01005 Flip Chip Package

Unidirectional ESD Protection in 01005 Flip Chip Package

Unidirectional ESD Protection in a 01005 Flip Chip Package Introduced

Unidirectional ESD Protection in a 01005 Flip Chip Package Introduced

Littelfuse, Inc. introduces its new series of three unidirectional TVS diode arrays in space-saving 01005 flip-chip packages


new products Feb 13, 2017 by Littelfuse
Seven DCMs in a ChiP Package

Seven DCMs in a ChiP Package

Vicor introduces seven new DCMs in a ChiP package that generate an isolated DC output


new products Feb 10, 2017 by Vicor
Automotive Thin-Film Chip Caps with Low ESR and High Q

Automotive Thin-Film Chip Caps with Low ESR and High Q

PoE IC Delivers 123W over 1Gbps CAT5e Cable

PoE IC Delivers 123W over 1Gbps CAT5e Cable

Record Revenue at Silicon Labs for Q4 and Full Year 2016

Record Revenue at Silicon Labs for Q4 and Full Year 2016


News Feb 02, 2017 by Jeff Shepard
Wireless Power Transmit IC Sends Power Over Distance

Wireless Power Transmit IC Sends Power Over Distance


News Jan 29, 2017 by Jeff Shepard