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ON Semiconductor Opens Bangalore Facility to Integrate Operations in India

ON Semiconductor Opens Bangalore Facility to Integrate Operations in India

News Mar 03, 2019 by Scott McMahan
40V Three-Phase Sensorless Sinusoidal Fan Driver IC Minimizes Vibration & Noise

40V Three-Phase Sensorless Sinusoidal Fan Driver IC Minimizes Vibration & Noise

new products Mar 01, 2019 by Scott McMahan
JEDEC Wide Bandgap Power Semiconductor Committee Publishes First Document Test Method for Dynamic Resistance of GaN HEMT

JEDEC Wide Bandgap Power Semiconductor Committee Publishes First Document Test Method for Dynamic Resistance of GaN HEMT

 JEDEC announces the publication of JEP173: Dynamic On-Resistance Test Method Guidelines for GaN HEMT Based Power Conversion Devices

new products Mar 01, 2019 by JEDEC
Power Module Substrate Options Available to Lower Semiconductor Junction Temperatures for Increased Reliability

Power Module Substrate Options Available to Lower Semiconductor Junction Temperatures for Increased Reliability

This article examines changing a power module's substrate as a possible option for lowering its semiconductors junction temperatures without…

Technical Articles Mar 01, 2019 by Jerry Moudilos
Single-Chip Wireless IoT Solution Improves Battery Life by Over 50%

Single-Chip Wireless IoT Solution Improves Battery Life by Over 50%

new products Feb 25, 2019 by Scott McMahan
ASIL-D Real-Time Automotive MCUs with 40MB of On-Chip Memory

ASIL-D Real-Time Automotive MCUs with 40MB of On-Chip Memory

new products Feb 21, 2019 by Scott McMahan
Heraeus and Toshiba Join Forces for the Development and Production of Silicon Nitride Ceramic Substrates Used in Hybrid and Electric Vehicles

Heraeus and Toshiba Join Forces for the Development and Production of Silicon Nitride Ceramic Substrates Used in Hybrid and Electric Vehicles

Heraeus Electronics, a leading provider of material solutions for the semiconductor industry and electronic packaging industry and Toshiba…

new products Feb 21, 2019 by Heraeus Electronics
ROHM Announces New HighReliability 1608Size White Chip LED

ROHM Announces New HighReliability 1608Size White Chip LED

ROHM today announced the availability of the SMLD12WBN1W, a White chip LED with 1608 (1.6x0.8mm) size that achieves class-leading reliability. This…

new products Feb 21, 2019 by ROHM
H-Bridge Driver IC with Integrated Arm Cortex M0 for Automotive

H-Bridge Driver IC with Integrated Arm Cortex M0 for Automotive

new products Feb 20, 2019 by Paul Shepard
3D Silicon™ Li-ion Battery to Deliver over 900Wh/l and 500 Cycle Life

3D Silicon™ Li-ion Battery to Deliver over 900Wh/l and 500 Cycle Life

News Feb 14, 2019 by Paul Shepard
Vicor Introduces Four New Tightly Regulated DC-DC Converter ChiP Modules

Vicor Introduces Four New Tightly Regulated DC-DC Converter ChiP Modules

The new entries in the extensive DCM™ family are available in the 3623(36 x 23mm) ChiP (Converter housed in Package™) with an unrivaled power…

new products Feb 14, 2019 by Vicor
STMicroelectronics to Acquire Majority Stake in Silicon Carbide Wafer Manufacturer Norstel AB

STMicroelectronics to Acquire Majority Stake in Silicon Carbide Wafer Manufacturer Norstel AB

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced it has signed…

new products Feb 13, 2019 by STMicroelectronics
Alpha and Omega Semiconductor Continues to Expand its Fifth Generation EZBuck Family

Alpha and Omega Semiconductor Continues to Expand its Fifth Generation EZBuck Family

Alpha and Omega Semiconductor Limited (AOS) today introduced  AOZ6662DI-01 and AOZ6663DI-01, high efficiency, simple-to-use synchronous buck…

new products Feb 07, 2019 by Alpha and Omega Semiconductor
3.3µF to 680µF Polymer Tantalum Molded Chip Capacitors Now in Z Case

3.3µF to 680µF Polymer Tantalum Molded Chip Capacitors Now in Z Case

new products Feb 06, 2019 by Scott McMahan
IWIPP 2019 to Address Wide Bandgap Semiconductor Power Packaging Challenges

IWIPP 2019 to Address Wide Bandgap Semiconductor Power Packaging Challenges

The International Workshop on Integrated Power Packaging announces IWIPP 2019, to be held in Toulouse, France, April 24-26, 2019.

new products Feb 06, 2019 by IWIPP
Diodes Incorporated to Acquire Texas Instruments Wafer Fab in Greenock, Scotland

Diodes Incorporated to Acquire Texas Instruments Wafer Fab in Greenock, Scotland

News Feb 05, 2019 by Scott McMahan
ON Semiconductor Reports Robust Fourth Quarter Despite Economic Slowdown

ON Semiconductor Reports Robust Fourth Quarter Despite Economic Slowdown

News Feb 04, 2019 by Scott McMahan
650V GaN FET Quality and Reliability Data Released by Transphorm

650V GaN FET Quality and Reliability Data Released by Transphorm

News Feb 01, 2019 by Paul Shepard
AEC-Q100 DC Motor H-Bridge Driver IC with LIN Communications

AEC-Q100 DC Motor H-Bridge Driver IC with LIN Communications

new products Feb 01, 2019 by Scott McMahan
On-Chip Optical Link can Connect High-Power Devices with Integrated Digital Control

On-Chip Optical Link can Connect High-Power Devices with Integrated Digital Control

News Jan 18, 2019 by Scott McMahan