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Quantum Physics of Paint-on Semiconductor Reveals Light and Solar Potential

Quantum Physics of Paint-on Semiconductor Reveals Light and Solar Potential


News Jan 18, 2019 by Scott McMahan
Alpha and Omega Semiconductor Introduces High-Current EZ Buck Regulator

Alpha and Omega Semiconductor Introduces High-Current EZ Buck Regulator

Alpha and Omega Semiconductor Limited today introduced a new family of EZBuck™ regulators.


Silicon Nanoparticles Found to Increase Lithium-Ion Battery Capacity Ten Times

Silicon Nanoparticles Found to Increase Lithium-Ion Battery Capacity Ten Times


News Jan 15, 2019 by Scott McMahan
Wide Terminal Low-Ohmic High Power Thick-Film Chip Resistor

Wide Terminal Low-Ohmic High Power Thick-Film Chip Resistor

ROHM has recently announced the availability of a new lineup of high power wide terminal thick-film chip resistors (10-910mΩ) ideal for current…


new products Jan 09, 2019 by ROHM
Cree and STMicroelectronics Announce MultiYear Silicon Carbide Wafer Supply Agreement

Cree and STMicroelectronics Announce MultiYear Silicon Carbide Wafer Supply Agreement

Cree, Inc. recently announced that it signed a multi-year agreement to produce and supply its Wolfspeed® silicon carbide (SiC) wafers to…


new products Jan 09, 2019 by Cree
IGSS GaN and SilTerra Demonstrate Powerful New Technology to  Unlock US12 Billion Semiconductor Opportunity

IGSS GaN and SilTerra Demonstrate Powerful New Technology to Unlock US12 Billion Semiconductor Opportunity

IGSS GaN (IGaN) and SilTerra Malaysia Sdn. Bhd. are pleased to announce the impressive results of their recent technology transfer partnership,…


new products Jan 09, 2019 by IGSS GaN
Wide Terminal Low-Ohmic High Power Thick-Film Chip Resistor

Wide Terminal Low-Ohmic High Power Thick-Film Chip Resistor

ROHM announced the availability of a new lineup of high power wide terminal thick-film chip resistors ideal for current detection in a variety of…


Technical Articles Jan 09, 2019 by ROHM
Schurter Announces UAI 1206 a Chip Fuse for High Demands

Schurter Announces UAI 1206 a Chip Fuse for High Demands

With the UAI 1206, SCHURTER offers a pulse and temperature resistant chip fuse with slow release characteristics for applications in which aging…


Sanan IC Announces Commercial Release of 6-Inch SiC Wafer Foundry Process

Sanan IC Announces Commercial Release of 6-Inch SiC Wafer Foundry Process


News Dec 21, 2018 by Paul Shepard
Driving SiC MOSFETs with a HighSpeed Gate Driver IC

Driving SiC MOSFETs with a HighSpeed Gate Driver IC

Silicon-Carbide (SiC) MOSFETs that become a visible part of the MOSFET market require special gate drivers that are able to provide a negative…


Third-Generation 0.18-Micron Bipolar-CMOS-DMOS Process Technology

Third-Generation 0.18-Micron Bipolar-CMOS-DMOS Process Technology


News Dec 20, 2018 by Paul Shepard
Chip-type Ceramic Rechargeable Batteries Coming in April 2019

Chip-type Ceramic Rechargeable Batteries Coming in April 2019


News Dec 16, 2018 by Paul Shepard
H-bridge Driver IC Supporting 1.8V Low-Voltage and 4.0A Current Drive

H-bridge Driver IC Supporting 1.8V Low-Voltage and 4.0A Current Drive

Vertical Ga2O3 Power FET Produced with Low-Cost, Highly-Manufacturable Ion Implantation Doping Process

Vertical Ga2O3 Power FET Produced with Low-Cost, Highly-Manufacturable Ion Implantation Doping Process


News Dec 13, 2018 by Paul Shepard
Thick-Film Chip Resistors Deliver Industry-Leading TCR Characteristics

Thick-Film Chip Resistors Deliver Industry-Leading TCR Characteristics

Automotive Data Flow Processor Test Chip Announced by NSITEXE

Automotive Data Flow Processor Test Chip Announced by NSITEXE


News Dec 13, 2018 by Paul Shepard
Flip Chip Schottky Diode in Low-Profile WLCSP

Flip Chip Schottky Diode in Low-Profile WLCSP

World’s First Industrial-Grade eSIM in Wafer-Level Chip-Scale Package

World’s First Industrial-Grade eSIM in Wafer-Level Chip-Scale Package


News Dec 10, 2018 by Paul Shepard
650V D-Mode GaN HEMTs Produced on 200mm Gan-on-Si Wafers with CMOS-Compatible Process

650V D-Mode GaN HEMTs Produced on 200mm Gan-on-Si Wafers with CMOS-Compatible Process


News Dec 06, 2018 by Paul Shepard
TowerJazz and KERI Prototyping SiC FET Gate Driver IC on 0.18um SOI Platform

TowerJazz and KERI Prototyping SiC FET Gate Driver IC on 0.18um SOI Platform


News Dec 03, 2018 by Paul Shepard