EEPower

Latest Silicon Carbide Articles

Categories

Half-Bridge Evaluation Board from GaN Systems and ON Semiconductor Demonstrates Next Performance Leap in GaN

Half-Bridge Evaluation Board from GaN Systems and ON Semiconductor Demonstrates Next Performance Leap in GaN

Half-Bridge Evaluation Board from GaN Systems and ON Semiconductor Demonstrates Next Performance Leap in GaN.

new products Nov 04, 2019 by GaN Systems
Baseus uses GaNFast from Navitas Semiconductor in 3-Output 65W Charger

Baseus uses GaNFast from Navitas Semiconductor in 3-Output 65W Charger

new products Oct 30, 2019 by Paul Shepard
Optima Design Launches Next-Generation Semiconductor Functional Safety Tools

Optima Design Launches Next-Generation Semiconductor Functional Safety Tools

News Oct 30, 2019 by Paul Shepard
Dialog Semiconductor Launches Configurable HighFrequency SubPMICs Powering Latest Mobile Processors

Dialog Semiconductor Launches Configurable HighFrequency SubPMICs Powering Latest Mobile Processors

Dialog Semiconductor Launches Configurable, High-Frequency Sub-PMICs Powering Latest Mobile Processors.

new products Oct 29, 2019 by Dialog Semiconductor
Search for the Next Ltd and Semefab Introduce a New Transistor Wafer Process Technology

Search for the Next Ltd and Semefab Introduce a New Transistor Wafer Process Technology

Search For The Next’s technology uses quantum tunnel mechanics enabling complex ICs to be made competitively in existing…

new products Oct 25, 2019 by Search for the Next
Cree & NY CREATES Announce First SiC Wafer Demonstration at SUNY Poly

Cree & NY CREATES Announce First SiC Wafer Demonstration at SUNY Poly

News Oct 23, 2019 by Paul Shepard
High-Capacitance 63V and 80V Chip-Type Aluminum Electrolytic Capacitors

High-Capacitance 63V and 80V Chip-Type Aluminum Electrolytic Capacitors

new products Oct 23, 2019 by Paul Shepard
Two-Phase, Direct-on-Chip, Liquid Cooling for Data Centers

Two-Phase, Direct-on-Chip, Liquid Cooling for Data Centers

News Oct 23, 2019 by Paul Shepard
Odyssey Semi Completes Strategic Acquisition of High-Voltage GaN Wafer Fab

Odyssey Semi Completes Strategic Acquisition of High-Voltage GaN Wafer Fab

News Oct 23, 2019 by Paul Shepard
Fraunhofer’s Modul Project Aims to Embed SiC Power Devices into Substrates

Fraunhofer’s Modul Project Aims to Embed SiC Power Devices into Substrates

News Oct 19, 2019 by Paul Shepard
Single-Chip ASIL-D-Compliant Battery Management IC for Mid-to-Large Cell Counts

Single-Chip ASIL-D-Compliant Battery Management IC for Mid-to-Large Cell Counts

new products Oct 17, 2019 by Paul Shepard
64-Channel High-Voltage Switch IC from STMicroelectronics Drives Portability with Performance in Medical and Industrial Imaging

64-Channel High-Voltage Switch IC from STMicroelectronics Drives Portability with Performance in Medical and Industrial Imaging

This article features STMicroelectronics STHV64SW 64-channel high-voltage analog-switch IC with unprecedented integration for advanced ultrasound…

new products Oct 16, 2019 by STMicroelectronics
Alpha and Omega Semiconductor Introduces Ultra-Low Clamping Voltage High-Surge TVS

Alpha and Omega Semiconductor Introduces Ultra-Low Clamping Voltage High-Surge TVS

This article highlights Alpha and Omega Semiconductor  AOZ8621UNI Transient Voltage Suppressor (TVS) for VBUS protection with high-surge TVS…

new products Oct 16, 2019 by Alpha and Omega Semiconductor
EMC Filters for GaN- and SiC-Based Power Converters

EMC Filters for GaN- and SiC-Based Power Converters

new products Oct 15, 2019 by Paul Shepard
64-Channel High-Voltage Switch IC for Medical and Industrial Imaging

64-Channel High-Voltage Switch IC for Medical and Industrial Imaging

new products Oct 15, 2019 by Paul Shepard
Industry-First Energy Harvesting Power Management Chip for Biometric Payment Devices

Industry-First Energy Harvesting Power Management Chip for Biometric Payment Devices

new products Oct 14, 2019 by Paul Shepard
200mm Semi-Insulating SiC Substrates for RF Power Amplifiers in 5G Antennas

200mm Semi-Insulating SiC Substrates for RF Power Amplifiers in 5G Antennas

News Oct 11, 2019 by Paul Shepard
Fraunhofer IZM is Putting the Electric Car in the Fast Lane

Fraunhofer IZM is Putting the Electric Car in the Fast Lane

Fraunhofer IZM is Putting the Electric Car in the Fast Lane.

new products Oct 11, 2019 by Fraunhofer IZM
Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging

Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging

News Oct 10, 2019 by Paul Shepard
ROHM Introduces New 4Pin Package SiC Mosfets

ROHM Introduces New 4Pin Package SiC Mosfets

This article highlights ROHM Semiconductors RV4xxx series development of ultra-compact 1.6x1.6mm size MOSFETs that deliver superior mounting…

new products Oct 10, 2019 by ROHM