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Vicor’s ChiP Power Component Packaging Technology to Make European Debut at PCIM

Vicor’s ChiP Power Component Packaging Technology to Make European Debut at PCIM

new products May 06, 2013 by Power Pulse1595211359
Kopin Acquires Majority Stake in Low-Power Mixed-Signal IC Design Company e-MDT

Kopin Acquires Majority Stake in Low-Power Mixed-Signal IC Design Company e-MDT

News May 05, 2013 by Jeff Shepard
KOA Speer and Stackpole Introduce Chip Resistors

KOA Speer and Stackpole Introduce Chip Resistors

new products Apr 24, 2013 by Jeff Shepard
Dual Half-Bridge Motor Driver IC Designed for Unidirectional Drive of Two DC Motors

Dual Half-Bridge Motor Driver IC Designed for Unidirectional Drive of Two DC Motors

new products Apr 23, 2013 by Jeff Shepard
Fairchild Semiconductor Q1 Financials are “Better than Seasonal”

Fairchild Semiconductor Q1 Financials are “Better than Seasonal”

News Apr 22, 2013 by Jeff Shepard
SiC-based Fault Current Limiter Developed at Arkansas’ NCREPT

SiC-based Fault Current Limiter Developed at Arkansas’ NCREPT

News Apr 22, 2013 by Jeff Shepard
Bridgelux Sells GaN-on-Silicon Technology/Chip related Assets to Toshiba

Bridgelux Sells GaN-on-Silicon Technology/Chip related Assets to Toshiba

News Apr 22, 2013 by Jeff Shepard
Fujitsu Semiconductor Releases Two Energy Harvesting Power Management ICs

Fujitsu Semiconductor Releases Two Energy Harvesting Power Management ICs

new products Apr 21, 2013 by Jeff Shepard
Cree and Delta Partner to Design Next-Generation Solar Inverters with SiC MOSFETs

Cree and Delta Partner to Design Next-Generation Solar Inverters with SiC MOSFETs

News Apr 16, 2013 by Jeff Shepard
TI Unveils Gas-Gauge IC for Lead-Acid Batteries Used in UPS and E-Bikes

TI Unveils Gas-Gauge IC for Lead-Acid Batteries Used in UPS and E-Bikes

new products Apr 15, 2013 by Jeff Shepard
IDT Claims First Wireless Power Receiver IC Compatible with Both WPC and PMA Standards

IDT Claims First Wireless Power Receiver IC Compatible with Both WPC and PMA Standards

new products Apr 15, 2013 by Jeff Shepard
Toshiba Starts SiC Power Device Volume Production, Aims for 30% Market Share

Toshiba Starts SiC Power Device Volume Production, Aims for 30% Market Share

new products Apr 10, 2013 by Jeff Shepard
Sankalp Semiconductor Appoints Samir Patel as CEO

Sankalp Semiconductor Appoints Samir Patel as CEO

News Mar 31, 2013 by Jeff Shepard
Mitsubishi Electric Delivers 140kVA SiC Auxiliary Power Supply Systems for Railcars

Mitsubishi Electric Delivers 140kVA SiC Auxiliary Power Supply Systems for Railcars

News Mar 25, 2013 by Jeff Shepard
ROHM SiC MOS Module, without a Schottky Diode Enters High-Volume Production

ROHM SiC MOS Module, without a Schottky Diode Enters High-Volume Production

new products Mar 20, 2013 by Jeff Shepard
Mouser Authorized for Global Distribution of Micrel’s High-Performance IC Solutions

Mouser Authorized for Global Distribution of Micrel’s High-Performance IC Solutions

News Mar 18, 2013 by Jeff Shepard
AOS Adds Buck LED Controller IC for High Efficiency and Robust Lighting Solutions

AOS Adds Buck LED Controller IC for High Efficiency and Robust Lighting Solutions

new products Mar 18, 2013 by Jeff Shepard
Vicor Intros New User-Defined, High-Performance VI Chip PRM Modules

Vicor Intros New User-Defined, High-Performance VI Chip PRM Modules

new products Mar 18, 2013 by Jeff Shepard
Allegro Adds Automotive Two-Channel Linear LED Driver IC

Allegro Adds Automotive Two-Channel Linear LED Driver IC

new products Mar 12, 2013 by Jeff Shepard
Global Power Device Comes out of Stealth, Launches SiC Devices

Global Power Device Comes out of Stealth, Launches SiC Devices

new products Mar 12, 2013 by Jeff Shepard