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Dual-Mode IC Supports Bluetooth Classic and LE 4.2

Dual-Mode IC Supports Bluetooth Classic and LE 4.2

new products Mar 07, 2017 by Jeff Shepard
Swatch Claims the World’s Smallest Bluetooth Chip

Swatch Claims the World’s Smallest Bluetooth Chip

News Mar 05, 2017 by Jeff Shepard
Misubishi adds 600V SiC Schottky-Barrier Diodes

Misubishi adds 600V SiC Schottky-Barrier Diodes

new products Mar 05, 2017 by Jeff Shepard
Opening of Blacksburg Virginia eGaN FET and IC Applications Center

Opening of Blacksburg Virginia eGaN FET and IC Applications Center

Efficient Power Conversion Corporation (EPC) is proud to announce the opening of an Applications Center in Blacksburg, Virginia.  

new products Mar 03, 2017 by EPC
High Voltage Ceramic Chip Capacitors Evaluated Acoustically

High Voltage Ceramic Chip Capacitors Evaluated Acoustically

This article discusses how acoustic micro imaging tools work and how it helps detect and keep defective capacitors out of production.

Technical Articles Mar 03, 2017 by Tom Adams
Littelfuse Owns Majority of SiC Device Maker Monolith Semi

Littelfuse Owns Majority of SiC Device Maker Monolith Semi

News Mar 02, 2017 by Jeff Shepard
SOI Wafer is a Suitable Substrate for GaN Crystals

SOI Wafer is a Suitable Substrate for GaN Crystals

News Mar 02, 2017 by Jeff Shepard
SiC Gate Driver Optimized for 62mm Modules

SiC Gate Driver Optimized for 62mm Modules

new products Feb 27, 2017 by Jeff Shepard
Ag-Sintering as an Enabler for Thermally Demanding Electronic and Semiconductor Applications

Ag-Sintering as an Enabler for Thermally Demanding Electronic and Semiconductor Applications

This article highlights Advanced Packaging Center and Alpha Assembly Solutions Silver (Ag) sintering proven and reliable bonding technology for…

Technical Articles Feb 27, 2017 by Marco Koelink
1200V 75mOhm SiC FET in Low-Inductance Package

1200V 75mOhm SiC FET in Low-Inductance Package

new products Feb 22, 2017 by Jeff Shepard
The Creation and Potential Cell Structures of SiC Devices

The Creation and Potential Cell Structures of SiC Devices

> <p>This article highlights ROHM about the potential structures of SiC devices, focusing on different structures and showing that…

Technical Articles Feb 22, 2017 by Aly Mashaly
Integrated Half-Bridge GaN Power IC

Integrated Half-Bridge GaN Power IC

new products Feb 20, 2017 by Power Pulse1595211359
160W and 375W DC-DCs in 0.29” High ChiP Packaging

160W and 375W DC-DCs in 0.29” High ChiP Packaging

new products Feb 16, 2017 by Jeff Shepard
Low-Leakage, Doping-Free 600V GaN HEMT Epiwafers

Low-Leakage, Doping-Free 600V GaN HEMT Epiwafers

News Feb 15, 2017 by Jeff Shepard
Automotive Three-Phase Isolated MOSFET Driver IC

Automotive Three-Phase Isolated MOSFET Driver IC

new products Feb 14, 2017 by Jeff Shepard
Unidirectional Linear Hall Sensor IC in Surface-Mount Package

Unidirectional Linear Hall Sensor IC in Surface-Mount Package

This article features Allegro Microsystems' ALS31000, a unidirectional linear Hall sensor integrated circuit for automotive and industrial…

new products Feb 14, 2017 by Allegro MicroSystems
Unidirectional ESD Protection in 01005 Flip Chip Package

Unidirectional ESD Protection in 01005 Flip Chip Package

new products Feb 13, 2017 by Jeff Shepard
48W Aux. Power Supply Evaluation Board for SiC FETs

48W Aux. Power Supply Evaluation Board for SiC FETs

new products Feb 13, 2017 by Jeff Shepard
Unidirectional ESD Protection in a 01005 Flip Chip Package Introduced

Unidirectional ESD Protection in a 01005 Flip Chip Package Introduced

Littelfuse, Inc. introduces its new series of three unidirectional TVS diode arrays in space-saving 01005 flip-chip packages

new products Feb 13, 2017 by Littelfuse
NY-PEMC Fabs Initial 150mm SiC-Based Patterned Wafers

NY-PEMC Fabs Initial 150mm SiC-Based Patterned Wafers

News Feb 12, 2017 by Jeff Shepard