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Littelfuse Owns Majority of SiC Device Maker Monolith Semi

Littelfuse Owns Majority of SiC Device Maker Monolith Semi


News Mar 02, 2017 by Jeff Shepard
SOI Wafer is a Suitable Substrate for GaN Crystals

SOI Wafer is a Suitable Substrate for GaN Crystals


News Mar 02, 2017 by Jeff Shepard
SiC Gate Driver Optimized for 62mm Modules

SiC Gate Driver Optimized for 62mm Modules

Ag-Sintering as an Enabler for Thermally Demanding Electronic and Semiconductor Applications

Ag-Sintering as an Enabler for Thermally Demanding Electronic and Semiconductor Applications

This article highlights Advanced Packaging Center and Alpha Assembly Solutions Silver (Ag) sintering proven and reliable bonding technology for…


1200V 75mOhm SiC FET in Low-Inductance Package

1200V 75mOhm SiC FET in Low-Inductance Package

The Creation and Potential Cell Structures of SiC Devices

The Creation and Potential Cell Structures of SiC Devices

> <p>This article highlights ROHM about the potential structures of SiC devices, focusing on different structures and showing that…


Integrated Half-Bridge GaN Power IC

Integrated Half-Bridge GaN Power IC

160W and 375W DC-DCs in 0.29” High ChiP Packaging

160W and 375W DC-DCs in 0.29” High ChiP Packaging

Low-Leakage, Doping-Free 600V GaN HEMT Epiwafers

Low-Leakage, Doping-Free 600V GaN HEMT Epiwafers


News Feb 15, 2017 by Jeff Shepard
Automotive Three-Phase Isolated MOSFET Driver IC

Automotive Three-Phase Isolated MOSFET Driver IC

Unidirectional Linear Hall Sensor IC in Surface-Mount Package

Unidirectional Linear Hall Sensor IC in Surface-Mount Package

This article features Allegro Microsystems' ALS31000, a unidirectional linear Hall sensor integrated circuit for automotive and industrial…


Unidirectional ESD Protection in 01005 Flip Chip Package

Unidirectional ESD Protection in 01005 Flip Chip Package

48W Aux. Power Supply Evaluation Board for SiC FETs

48W Aux. Power Supply Evaluation Board for SiC FETs

Unidirectional ESD Protection in a 01005 Flip Chip Package Introduced

Unidirectional ESD Protection in a 01005 Flip Chip Package Introduced

Littelfuse, Inc. introduces its new series of three unidirectional TVS diode arrays in space-saving 01005 flip-chip packages


new products Feb 13, 2017 by Littelfuse
NY-PEMC Fabs Initial 150mm SiC-Based Patterned Wafers

NY-PEMC Fabs Initial 150mm SiC-Based Patterned Wafers


News Feb 12, 2017 by Jeff Shepard
SiC Computer Chips for Longer Venus Surface Missions

SiC Computer Chips for Longer Venus Surface Missions


News Feb 12, 2017 by Jeff Shepard
Seven DCMs in a ChiP Package

Seven DCMs in a ChiP Package

Vicor introduces seven new DCMs in a ChiP package that generate an isolated DC output


new products Feb 10, 2017 by Vicor
Automotive Thin-Film Chip Caps with Low ESR and High Q

Automotive Thin-Film Chip Caps with Low ESR and High Q

PoE IC Delivers 123W over 1Gbps CAT5e Cable

PoE IC Delivers 123W over 1Gbps CAT5e Cable

Motor Control for SiC Drives Embedded in Automotive MCUs

Motor Control for SiC Drives Embedded in Automotive MCUs