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Unidirectional ESD Protection in 01005 Flip Chip Package

Unidirectional ESD Protection in 01005 Flip Chip Package

48W Aux. Power Supply Evaluation Board for SiC FETs

48W Aux. Power Supply Evaluation Board for SiC FETs

Unidirectional ESD Protection in a 01005 Flip Chip Package Introduced

Unidirectional ESD Protection in a 01005 Flip Chip Package Introduced

Littelfuse, Inc. introduces its new series of three unidirectional TVS diode arrays in space-saving 01005 flip-chip packages


new products Feb 13, 2017 by Littelfuse
NY-PEMC Fabs Initial 150mm SiC-Based Patterned Wafers

NY-PEMC Fabs Initial 150mm SiC-Based Patterned Wafers


News Feb 12, 2017 by Jeff Shepard
SiC Computer Chips for Longer Venus Surface Missions

SiC Computer Chips for Longer Venus Surface Missions


News Feb 12, 2017 by Jeff Shepard
Seven DCMs in a ChiP Package

Seven DCMs in a ChiP Package

Vicor introduces seven new DCMs in a ChiP package that generate an isolated DC output


new products Feb 10, 2017 by Vicor
Automotive Thin-Film Chip Caps with Low ESR and High Q

Automotive Thin-Film Chip Caps with Low ESR and High Q

PoE IC Delivers 123W over 1Gbps CAT5e Cable

PoE IC Delivers 123W over 1Gbps CAT5e Cable

Motor Control for SiC Drives Embedded in Automotive MCUs

Motor Control for SiC Drives Embedded in Automotive MCUs

EU CHALLENGE Project Seeks 3C-SiC Devices for EVs

EU CHALLENGE Project Seeks 3C-SiC Devices for EVs


News Jan 31, 2017 by Jeff Shepard
650V and 1200V SiC Schottkys for Multi-kW Designs

650V and 1200V SiC Schottkys for Multi-kW Designs

Wireless Power Transmit IC Sends Power Over Distance

Wireless Power Transmit IC Sends Power Over Distance


News Jan 29, 2017 by Jeff Shepard
The Creation of Silicon Carbide  Revolutionary Semiconductor

The Creation of Silicon Carbide Revolutionary Semiconductor

This article highlights SiCrystal AG and Rohm Semiconductor GmbH for the potential of Silicon Carbide material for power and RF electronics…


Power Management IC Targets DDR4 NVDIMMs

Power Management IC Targets DDR4 NVDIMMs

Innovative Glass Substrates for Semiconductor Packaging

Innovative Glass Substrates for Semiconductor Packaging


News Jan 19, 2017 by Jeff Shepard
1608mm Size Metal Alloy Chip Inductor

1608mm Size Metal Alloy Chip Inductor

Mouser Signs Global Agreement with United Silicon Carbide

Mouser Signs Global Agreement with United Silicon Carbide


News Jan 18, 2017 by Jeff Shepard
Precision Thin-Film Tantalum Nitride Chip Resistors

Precision Thin-Film Tantalum Nitride Chip Resistors

Low-Voltage Bipolar Stepper or Dual DC Motor Driver IC

Low-Voltage Bipolar Stepper or Dual DC Motor Driver IC

650V SiC Schottkys Handle 70% More Surge Current

650V SiC Schottkys Handle 70% More Surge Current