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High Density Power Amplifier IC Delivers New Levels of Performance

High Density Power Amplifier IC Delivers New Levels of Performance

This article features the Apex Microtechnology's PA164 and PA165 enhancements and benefits in power amplifier performance.

new products Dec 08, 2017 by Apex Microtechnology
Buck-Boost IC Supports Simultaneous USB PD and Wireless Charging

Buck-Boost IC Supports Simultaneous USB PD and Wireless Charging

new products Dec 05, 2017 by Paul Shepard
Factors Quantified for Reducing SiC MOSFET Resistance by Two-Thirds

Factors Quantified for Reducing SiC MOSFET Resistance by Two-Thirds

News Dec 05, 2017 by Paul Shepard
Full SiC Power Modules for Formula E Racing Team Venturi

Full SiC Power Modules for Formula E Racing Team Venturi

News Dec 01, 2017 by Paul Shepard
Carbon-Nanotube Sheets for Heat-Dissipation in SiC-based Vehicle Systems

Carbon-Nanotube Sheets for Heat-Dissipation in SiC-based Vehicle Systems

News Nov 30, 2017 by Paul Shepard
Single-Chip Solution with On-Chip Redundancy for Functional Safety

Single-Chip Solution with On-Chip Redundancy for Functional Safety

new products Nov 25, 2017 by Paul Shepard
Quad Full-Bridge PWM Motor Driver IC

Quad Full-Bridge PWM Motor Driver IC

new products Nov 20, 2017 by Paul Shepard
Sulfur-Resistant, AEC-Q200-Compliant Thick-Film Chip Resistors

Sulfur-Resistant, AEC-Q200-Compliant Thick-Film Chip Resistors

new products Nov 20, 2017 by Paul Shepard
300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1µm Pitch

300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1µm Pitch

News Nov 13, 2017 by Paul Shepard
High-Power Thin-Film Chip Resistors Replace Larger Devices

High-Power Thin-Film Chip Resistors Replace Larger Devices

new products Nov 13, 2017 by Paul Shepard
ON Semiconductor Reports Expanding Margins in Q3 2017

ON Semiconductor Reports Expanding Margins in Q3 2017

News Nov 06, 2017 by Paul Shepard
SiC Devices, Power in 3D Packaging, and More at IEDM 2017

SiC Devices, Power in 3D Packaging, and More at IEDM 2017

News Nov 01, 2017 by Paul Shepard
Wireless Power Transmitter Chip Provides 4X the Power

Wireless Power Transmitter Chip Provides 4X the Power

new products Oct 31, 2017 by Paul Shepard
Brushed Motor Driver IC with Dual 4.5A Channels

Brushed Motor Driver IC with Dual 4.5A Channels

new products Oct 30, 2017 by Paul Shepard
Advanced Si-IGBT Chip Design for Maximum Overall System Performance

Advanced Si-IGBT Chip Design for Maximum Overall System Performance

This article discusses the improvements brought by equipping sense emitter feature and on-chip temperature sensor to Si-IGBT modules.

Technical Articles Oct 30, 2017 by Narender Lakshmanan
First Power Management IC for DDR5 Server Memory Modules

First Power Management IC for DDR5 Server Memory Modules

new products Oct 24, 2017 by Paul Shepard
Automotive Bipolar Stepper Motor or Dual DC Motor Driver IC

Automotive Bipolar Stepper Motor or Dual DC Motor Driver IC

new products Oct 24, 2017 by Paul Shepard
Switch 100kVA at 50kHz with SiC Power Evaluation Platform

Switch 100kVA at 50kHz with SiC Power Evaluation Platform

News Oct 23, 2017 by Paul Shepard
Cree aiming to Double SiC Capacity at Wolfspeed

Cree aiming to Double SiC Capacity at Wolfspeed

News Oct 19, 2017 by Paul Shepard
Second-Generation 650V SiC Schottky Barrier Diodes in DPAK

Second-Generation 650V SiC Schottky Barrier Diodes in DPAK

new products Oct 17, 2017 by Paul Shepard