New Industry Products

Vishay TrenchFET® Power MOSFET In MICRO FOOT® Chipscale Package Features Backside Insulation

January 21, 2009 by Jeff Shepard

Vishay Intertechnology, Inc. released what it describes as the industry’s first TrenchFET power MOSFET in the chipscale MICRO FOOT package to feature backside insulation.

The Si8422DB is optimized for power amplifier, battery, and load switching in portable devices such as cell phones, PDAs, digital cameras, MP3 players, and smart phones. The 2-mil backside coating of the device insulates the top of the MICRO FOOT package to prevent electrical shorts from being created by temporary contact with moving parts in portable devices.

This insulation allows the device to be used in applications with very thin height requirements, providing designers with the flexibility to place the MOSFET where other items may be directly above it, such as shielding, buttons, or touch screens, which further compress the product height when depressed. This layout flexibility also translates into reduced parasitics, as the traces can be better optimized by not having to be routed to areas on the PCB with less height restrictions.

The 20V n-channel Si8422DB features an ultra-compact 1.55 by 1.55mm footprint with a slim 0.64mm profile. The device offers a low on-resistance range from 0.043Ω at 1.8V VGS to 0.037 at 4.5V VGS, with a maximum gate-source voltage of +/18V.

Samples and production quantities of the new Si8422DB are available now, with lead times of 10 to 12 weeks for larger orders. Pricing for U.S. delivery in 100,000-piece quantities starts at $0.20.