Honeywell Develops Lead-Free Thermal Management Material For Semiconductors
Honeywell announced that it has developed a new lead-free packaging technology that improves the thermal management of semiconductor chips.The new product, called Honeywell Pb-free Die Attach Solder, is a lead-free thermal interface material that effectively manages the tremendous heat produced by semiconductor chips in order to improve chip reliability.
"Honeywell has been developing lead-free die attach solder alloys for many years to meet the industry’s ’green’ requirements that emerged with the use of lead-free solder at the circuit board level," said Scott Miller, Metals Product Line Manager for Honeywell Electronic Materials. "Our newest alloys will replace the high-lead alloys and provide better thermal management than other proposed lead-free thermal management alternatives such as polymer-based materials."
Honeywell’s thermal management materials are designed to help the semiconductor packaging industry dissipate heat by filling the gap between the semiconductor and the heat spreader.
Targeting the semiconductor industry’s power device segment, Pb-free Die Attach Solder will be used in chips that service a wide range of industries, from automotives to cell phones.
The lead free material is based on Honeywell’s metallurgical expertise and long experience as a supplier of die-attach solders. Honeywell Pb-free Die Attach Solder is designed to be used mainly in wire form and compliments Honeywell’s large diameter aluminum wire products. The company claims that the technology provides power device manufacturers with a lower cost, more effective and greener alternative.
