This article introduces and discusses Danfoss' power module technology platform, DCM™1000, for automotive traction applications.
This article introduces and discusses Danfoss' power module technology platform, DCM™1000, for automotive traction applications.
This article introduces and discusses Vincotech's new flow E IGBT M7 and the upgraded MiniSKiiP® IGBT M7 product lines.
This article introduces and discusses Vincotech's new flow E IGBT M7 and the upgraded MiniSKiiP® IGBT M7 product lines.
Molded Core Power Inductors or Bus Bars for Automotive and Industrial ApplicationsChokes and Bus Bar Solutions by Chang…
Molded Core Power Inductors or Bus Bars for Automotive and Industrial ApplicationsChokes and Bus Bar Solutions by Chang Sung Corporation (CSC) are…
Transphorm Inc.—the leader in the design and manufacturing of the highest reliability and first JEDEC- and AEC-Q101…
Transphorm Inc.—the leader in the design and manufacturing of the highest reliability and first JEDEC- and AEC-Q101 qualified 650 V gallium…
Addressing the fast-growing demand for silicon carbide (SiC) solutions, Infineon Technologies launches devices in the…
Addressing the fast-growing demand for silicon carbide (SiC) solutions, Infineon Technologies launches devices in the 1200V CoolSiC™ MOSFET…
Nexperia, the global leader in discretes, logic, and MOSFET devices, today announced that in just two years as a…
Nexperia, the global leader in discretes, logic, and MOSFET devices, today announced that in just two years as a standalone company, it is…
GaN Systems announced the availability of the GS-065 low current transistor line.
GaN Systems announced the availability of the GS-065 low current transistor line.
Indium Corporation will feature its indium and gallium metals and compounds, and their related reclaim services, at SVC…
Indium Corporation will feature its indium and gallium metals and compounds, and their related reclaim services, at SVC TechCon 2019, April 27-May…
Power Integrations, the leader in gate-driver technology for medium- and high-voltage inverter applications, today…
Power Integrations, the leader in gate-driver technology for medium- and high-voltage inverter applications, today announced a range of…
This article discusses the performance benefits arising from the use of a low-inductive SMD package with a Kelvin-Source…
This article discusses the performance benefits arising from the use of a low-inductive SMD package with a Kelvin-Source pin for fast SiC MOSFETs.
Hans Keller joins Höganäs as President Product Area Surface & Joining Technologies on 1 March 2019.
Hans Keller joins Höganäs as President Product Area Surface & Joining Technologies on 1 March 2019.
Power Integrations, the leader in gate-driver technology for medium- and high-voltage inverter applications, today…
Power Integrations, the leader in gate-driver technology for medium- and high-voltage inverter applications, today announced the SIC1182K…
JEDEC announces the publication of JEP173: Dynamic On-Resistance Test Method Guidelines for GaN HEMT Based Power…
JEDEC announces the publication of JEP173: Dynamic On-Resistance Test Method Guidelines for GaN HEMT Based Power Conversion Devices
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