This article examines changing a power module's substrate as a possible option for lowering its semiconductors junction…
This article examines changing a power module's substrate as a possible option for lowering its semiconductors junction temperatures without…
This article features Proton-Electrotex MCDA – an advanced 1200V full-SiC module in well-known footprint, featuring an…
This article features Proton-Electrotex MCDA – an advanced 1200V full-SiC module in well-known footprint, featuring an ultra-low inductance…
IXYS Corporation introduces new IXIDM1403 driver module to serve the market with IGBT driver parts that enable a short…
IXYS Corporation introduces new IXIDM1403 driver module to serve the market with IGBT driver parts that enable a short design cycle and the lowest…
This article discusses the Enhanced Trench cell or TSPT+ technology and its features and advantages.
This article discusses the Enhanced Trench cell or TSPT+ technology and its features and advantages.
This article presents the LoPak1 module created through a holistic design approach and elaborated on the significant…
This article presents the LoPak1 module created through a holistic design approach and elaborated on the significant improvements of the module.
This article introduces Alpha & Omega Semiconductors' new IGBT Module that is specifically designed for induction heating…
This article introduces Alpha & Omega Semiconductors' new IGBT Module that is specifically designed for induction heating (IH)…
Alpha and Omega Semiconductor Limited (AOS) today introduced the AOZ5131QI, the latest generation of power modules.
Alpha and Omega Semiconductor Limited (AOS) today introduced the AOZ5131QI, the latest generation of power modules.
This article discusses the features and advantages of intelligent power modules in terms of costs, size, thermal and…
This article discusses the features and advantages of intelligent power modules in terms of costs, size, thermal and overcurrent protection.
Infineon Technologies AG introduces the fifth generation of the stand-alone quasi-resonant flyback controller and…
Infineon Technologies AG introduces the fifth generation of the stand-alone quasi-resonant flyback controller and integrated power IC CoolSET™…
This article features the 7th generation IGBT Module based on SLC (SoLid Cover)-Technology with high reliability and high…
This article features the 7th generation IGBT Module based on SLC (SoLid Cover)-Technology with high reliability and high thermal conductivity.
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