This article presents a new alternative, H6.5, and briefly discusses operating principles, and benchmarks H-bridge, H6.5 and HERIC® topologies.
This article presents a new alternative, H6.5, and briefly discusses operating principles, and benchmarks H-bridge, H6.5 and HERIC® topologies.
This article discusses the new standard dual-module package specially developed for High Voltage IGBTs HVIGBTs used in…
This article discusses the new standard dual-module package specially developed for High Voltage IGBTs HVIGBTs used in railway applications.
Dengrove Electronic Components has extended its portfolio of EN50155-compliant DC/DC converters by introducing the RECOM…
Dengrove Electronic Components has extended its portfolio of EN50155-compliant DC/DC converters by introducing the RECOM RPA120H-RW
This article describes the challenges of inverter-based induction cooking and introduces a new technology that meets the…
This article describes the challenges of inverter-based induction cooking and introduces a new technology that meets the technical and price…
This article discusses how an 8-bit MCU can be used to alleviate design challenges and create high-performance…
This article discusses how an 8-bit MCU can be used to alleviate design challenges and create high-performance switched-mode LED driving solutions.
This article features Allegro Microsystems' ALS31000, a unidirectional linear Hall sensor integrated circuit for…
This article features Allegro Microsystems' ALS31000, a unidirectional linear Hall sensor integrated circuit for automotive and industrial…
This article discusses the application of technologies of low-temperature sintering of silicon wafers and molybdenum…
This article discusses the application of technologies of low-temperature sintering of silicon wafers and molybdenum discs using the silver…
This article introduces octal high-side switch and driver from Maxim Integrated Products
This article introduces octal high-side switch and driver from Maxim Integrated Products
Semikron announced a technology collaboration with National Instruments (NI)to help lower the cost and risks of…
Semikron announced a technology collaboration with National Instruments (NI)to help lower the cost and risks of developing power conversion products
Texas Instruments introduces a pair of 12-V, 10-A, 4-MHz step-down power modules that is 20 percent smaller than any…
Texas Instruments introduces a pair of 12-V, 10-A, 4-MHz step-down power modules that is 20 percent smaller than any other 10-A power module-based…
Littelfuse, Inc. introduces its new series of three unidirectional TVS diode arrays in space-saving 01005 flip-chip packages
Littelfuse, Inc. introduces its new series of three unidirectional TVS diode arrays in space-saving 01005 flip-chip packages
The 62nd annual IEEE International Electron Devices Meeting, (IEDM) was held in San Francisco, California, USA December 3…
The 62nd annual IEEE International Electron Devices Meeting, (IEDM) was held in San Francisco, California, USA December 3 - 7, 2016. For more than six
This article features Broadcom's Gallium Nitride (GaN) Transistor Gate Drive Optocouplers and discusses its advantages,…
This article features Broadcom's Gallium Nitride (GaN) Transistor Gate Drive Optocouplers and discusses its advantages, marketing, drive and…
Exar Corporation named David Matteucci to the position of Division Vice President of Corporate Quality and Reliability
Exar Corporation named David Matteucci to the position of Division Vice President of Corporate Quality and Reliability
Vicor introduces seven new DCMs in a ChiP package that generate an isolated DC output
Vicor introduces seven new DCMs in a ChiP package that generate an isolated DC output
At SPS in Nuremberg ROHM Semiconductor presented its Arduino-based evaluation kit (EVK) to support the evaluation of its…
At SPS in Nuremberg ROHM Semiconductor presented its Arduino-based evaluation kit (EVK) to support the evaluation of its motor driver devices as…
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