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First GaN Power ICs Leave Silicon Behind

First GaN Power ICs Leave Silicon Behind

Navitas Semiconductor announced the world’s first Gallium Nitride (GaN) Power ICs, using its proprietary AllGaN™ monolithically-integrated 650V…


Audio IC Enables a New Immersive Headset Experience

Audio IC Enables a New Immersive Headset Experience

Panasonic Showcases GaN, Thermal and Passive Solutions

Panasonic Showcases GaN, Thermal and Passive Solutions

Silicon and GaN Transistor Comparison: Optimized Inverter Design

Silicon and GaN Transistor Comparison: Optimized Inverter Design

This article highlights the advantages of GaN E-HMET from GaN Systems over the conventional silicon-based IGBT and MOSFET inverter solutions.


Packaging for High-Voltage GaN Power Transistors

Packaging for High-Voltage GaN Power Transistors

Single Chip Hybrid PLC and LoRa IoT Wireless Platform

Single Chip Hybrid PLC and LoRa IoT Wireless Platform

1-MHz Bandwidth Hall-Effect-Based Current Sensor IC

1-MHz Bandwidth Hall-Effect-Based Current Sensor IC

28V 30W GaN HEMT Die now Available

28V 30W GaN HEMT Die now Available

Dimming Interface IC reduces Components up to 70%

Dimming Interface IC reduces Components up to 70%

GaN Transistors in Inverters, Motors, and Power Modules

GaN Transistors in Inverters, Motors, and Power Modules

MACOM Sues Infineon over GaN Technology

MACOM Sues Infineon over GaN Technology


News Apr 26, 2016 by Jeff Shepard
Six Videos Featuring GaN Technology Applications

Six Videos Featuring GaN Technology Applications


News Apr 25, 2016 by Jeff Shepard
LED Driver Provides Single Chip TRIAC and Digital Dimming

LED Driver Provides Single Chip TRIAC and Digital Dimming

Thick-Film, Multi-Resistance-Value Chip Resistor Arrays

Thick-Film, Multi-Resistance-Value Chip Resistor Arrays

600-V GaN FET Power Stage

600-V GaN FET Power Stage

Increased Packing Density From Double-Sided Power Semiconductor Cooling

Increased Packing Density From Double-Sided Power Semiconductor Cooling

This article discusses the method of increasing packing density of power electronics using Chip-on-Heatsink Technology for better thermal management.


Thermal Management Materials for SiC and GaN Devices

Thermal Management Materials for SiC and GaN Devices

MPAC-Doherty devices Support GaN PA Frequencies

MPAC-Doherty devices Support GaN PA Frequencies

AIX G5+ C Qualified for Production of imec GaN-on-Si Materials

AIX G5+ C Qualified for Production of imec GaN-on-Si Materials


News Apr 18, 2016 by Jeff Shepard
650V GaN 2kW Half-Bridge Evaluation Board

650V GaN 2kW Half-Bridge Evaluation Board


News Apr 13, 2016 by Jeff Shepard