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Single-Chip Balun for sub-1GHz Radio Reduces Board Space by 96%

Single-Chip Balun for sub-1GHz Radio Reduces Board Space by 96%

Temperature Sensor IC for Wireless Tags Runs 1 Year on 30mAh Battery

Temperature Sensor IC for Wireless Tags Runs 1 Year on 30mAh Battery


News Dec 18, 2017 by Paul Shepard
Delta Joins BMW i Ventures as Strategic Investor in GaN Systems

Delta Joins BMW i Ventures as Strategic Investor in GaN Systems


News Dec 11, 2017 by Paul Shepard
Give the Gift of GaN Class-D Audio

Give the Gift of GaN Class-D Audio

High Density Power Amplifier IC Delivers New Levels of Performance

High Density Power Amplifier IC Delivers New Levels of Performance

This article features the Apex Microtechnology's PA164 and PA165 enhancements and benefits in power amplifier performance.


5kV GaN Power Devices for Distribution-Level Voltages in the Utility Grid

5kV GaN Power Devices for Distribution-Level Voltages in the Utility Grid


News Dec 07, 2017 by Paul Shepard
Buck-Boost IC Supports Simultaneous USB PD and Wireless Charging

Buck-Boost IC Supports Simultaneous USB PD and Wireless Charging

GaN FETs Drive 150-Amp LiDAR Dev Board and Deliver 5-nsec. Pulses

GaN FETs Drive 150-Amp LiDAR Dev Board and Deliver 5-nsec. Pulses


News Nov 30, 2017 by Paul Shepard
Single-Chip Solution with On-Chip Redundancy for Functional Safety

Single-Chip Solution with On-Chip Redundancy for Functional Safety

Quad Full-Bridge PWM Motor Driver IC

Quad Full-Bridge PWM Motor Driver IC

Sulfur-Resistant, AEC-Q200-Compliant Thick-Film Chip Resistors

Sulfur-Resistant, AEC-Q200-Compliant Thick-Film Chip Resistors

100-mm Diameter Free-Standing GaN from Kyma / QROMIS Partnership

100-mm Diameter Free-Standing GaN from Kyma / QROMIS Partnership


News Nov 14, 2017 by Paul Shepard
300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1µm Pitch

300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1µm Pitch


News Nov 13, 2017 by Paul Shepard
High-Power Thin-Film Chip Resistors Replace Larger Devices

High-Power Thin-Film Chip Resistors Replace Larger Devices

Beryllium-Doped Gallium-Nitride for Higher-Power Devices

Beryllium-Doped Gallium-Nitride for Higher-Power Devices


News Nov 10, 2017 by Paul Shepard
Kyma Demonstrates High Quality 200-mm GaN on QST® Templates

Kyma Demonstrates High Quality 200-mm GaN on QST® Templates


News Nov 07, 2017 by Paul Shepard
ON Semiconductor Reports Expanding Margins in Q3 2017

ON Semiconductor Reports Expanding Margins in Q3 2017


News Nov 06, 2017 by Paul Shepard
Wireless Power Transmitter Chip Provides 4X the Power

Wireless Power Transmitter Chip Provides 4X the Power

Brushed Motor Driver IC with Dual 4.5A Channels

Brushed Motor Driver IC with Dual 4.5A Channels

Advanced Si-IGBT Chip Design for Maximum Overall System Performance

Advanced Si-IGBT Chip Design for Maximum Overall System Performance

This article discusses the improvements brought by equipping sense emitter feature and on-chip temperature sensor to Si-IGBT modules.