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Sankalp Semiconductor Appoints Samir Patel as CEO

Sankalp Semiconductor Appoints Samir Patel as CEO


News Mar 31, 2013 by Jeff Shepard
Fairchild’s WebDesigner Now Provides CCM, Non-Isolated PFC Buck and Buck LED Driver Designs in Under a Minute

Fairchild’s WebDesigner Now Provides CCM, Non-Isolated PFC Buck and Buck LED Driver Designs in Under a Minute


News Mar 31, 2013 by Jeff Shepard
Mitsubishi Electric Delivers 140kVA SiC Auxiliary Power Supply Systems for Railcars

Mitsubishi Electric Delivers 140kVA SiC Auxiliary Power Supply Systems for Railcars


News Mar 25, 2013 by Jeff Shepard
Infineon Enters the Market for High-Voltage Hyperfast Silicon Diodes

Infineon Enters the Market for High-Voltage Hyperfast Silicon Diodes

Toshiba Debuts 600V Super Junction MOSFET DTMOS IV High Speed Diode Series

Toshiba Debuts 600V Super Junction MOSFET DTMOS IV High Speed Diode Series

Extreme Power Efficiency Brings “Install-&-Forget” to Internet of Things

Extreme Power Efficiency Brings “Install-&-Forget” to Internet of Things

ROHM SiC MOS Module, without a Schottky Diode Enters High-Volume Production

ROHM SiC MOS Module, without a Schottky Diode Enters High-Volume Production

APEI and GaN Systems Demonstrate High-Efficiency DC-DC Boost Converter with GaN Switch

APEI and GaN Systems Demonstrate High-Efficiency DC-DC Boost Converter with GaN Switch


News Mar 18, 2013 by Jeff Shepard
Mouser Authorized for Global Distribution of Micrel’s High-Performance IC Solutions

Mouser Authorized for Global Distribution of Micrel’s High-Performance IC Solutions


News Mar 18, 2013 by Jeff Shepard
AOS Adds Buck LED Controller IC for High Efficiency and Robust Lighting Solutions

AOS Adds Buck LED Controller IC for High Efficiency and Robust Lighting Solutions

20-V P-Channel FET in 3.3-mm Square Package with On-Resistance of 4.8 mΩ Added by Vishay

20-V P-Channel FET in 3.3-mm Square Package with On-Resistance of 4.8 mΩ Added by Vishay

Vicor Intros New User-Defined, High-Performance VI Chip PRM Modules

Vicor Intros New User-Defined, High-Performance VI Chip PRM Modules

Tyndall to Lead Development of Nanotechnology for Energy-Efficient Automotive Electronics

Tyndall to Lead Development of Nanotechnology for Energy-Efficient Automotive Electronics


News Mar 14, 2013 by Jeff Shepard
100-V Enhancement-Mode eGaN FETs Evaluated Faster with New Development Board

100-V Enhancement-Mode eGaN FETs Evaluated Faster with New Development Board


News Mar 14, 2013 by Jeff Shepard
Andes Technology to Bring Energy Efficient Processor Cores to the U.S. Market

Andes Technology to Bring Energy Efficient Processor Cores to the U.S. Market


News Mar 13, 2013 by Jeff Shepard
Microsemi Adds Multiple Devices to NPT IGBT Product Family

Microsemi Adds Multiple Devices to NPT IGBT Product Family

MicroGen/X-FAB Completes Piezo-MEMS Vibration Energy Harvester Process Transfer

MicroGen/X-FAB Completes Piezo-MEMS Vibration Energy Harvester Process Transfer


News Mar 12, 2013 by Jeff Shepard
Transphorm Scales Up to 200-mm Wafers with AIX G5+ GaN-on-Si System from AIXTRON

Transphorm Scales Up to 200-mm Wafers with AIX G5+ GaN-on-Si System from AIXTRON


News Mar 12, 2013 by Jeff Shepard
Allegro Adds Automotive Two-Channel Linear LED Driver IC

Allegro Adds Automotive Two-Channel Linear LED Driver IC

Transphorm Releases First JEDEC-Qualified 600V GaN-on-Silicon Power Devices

Transphorm Releases First JEDEC-Qualified 600V GaN-on-Silicon Power Devices