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Global Power Device Comes out of Stealth, Launches SiC Devices

Global Power Device Comes out of Stealth, Launches SiC Devices

new products Mar 12, 2013 by Jeff Shepard
Intersil’s ISL6446A Dual PWM/Linear Controller Provides Efficient, Flexible Single-Chip Solution

Intersil’s ISL6446A Dual PWM/Linear Controller Provides Efficient, Flexible Single-Chip Solution

new products Mar 12, 2013 by Jeff Shepard
Second-Generation SiC MOSFETs from Cree Deliver Twice the Amps-Per-Dollar

Second-Generation SiC MOSFETs from Cree Deliver Twice the Amps-Per-Dollar

new products Mar 12, 2013 by Jeff Shepard
10A / 1200V SiC Schottky Rectifier Improves High-Temperature Performance

10A / 1200V SiC Schottky Rectifier Improves High-Temperature Performance

new products Mar 11, 2013 by Jeff Shepard
Power Integrations Names Radu Barsan Vice President of Technology

Power Integrations Names Radu Barsan Vice President of Technology

News Mar 10, 2013 by Jeff Shepard
Hybrid SiC Schottky Rectifier/Si IGBT Modules from GeneSiC Enables 175C Operation

Hybrid SiC Schottky Rectifier/Si IGBT Modules from GeneSiC Enables 175C Operation

new products Mar 06, 2013 by Jeff Shepard
Diodes Incorporated Closes Acquisition of BCD Semiconductor

Diodes Incorporated Closes Acquisition of BCD Semiconductor

News Mar 05, 2013 by Jeff Shepard
SemiSouth Lab’s SiC Manufacturing and Test Equipment to be Sold via Global Webcast Auction

SemiSouth Lab’s SiC Manufacturing and Test Equipment to be Sold via Global Webcast Auction

News Mar 05, 2013 by Jeff Shepard
Toshiba Launches 100V Low ON-Resistance N-ch Power MOSFET for Automotive Applications

Toshiba Launches 100V Low ON-Resistance N-ch Power MOSFET for Automotive Applications

new products Mar 05, 2013 by Jeff Shepard
MagnaChip to Offer 0.35um Ultra-High Voltage BCD Process for Integrated Smart Energy Applications

MagnaChip to Offer 0.35um Ultra-High Voltage BCD Process for Integrated Smart Energy Applications

News Mar 03, 2013 by Jeff Shepard
High-Voltage Hermetic SiC MOSFETs for use in High-Temp. and Harsh Environments

High-Voltage Hermetic SiC MOSFETs for use in High-Temp. and Harsh Environments

new products Feb 27, 2013 by Jeff Shepard
Transphorm Teams with Yskawa for GaN-based High-Power Converter

Transphorm Teams with Yskawa for GaN-based High-Power Converter

News Feb 26, 2013 by Jeff Shepard
GaN Systems Expands With New Technical Support Office in the UK

GaN Systems Expands With New Technical Support Office in the UK

News Feb 26, 2013 by Jeff Shepard
IXYS Integrates Thyristor and IGBT to offer “Ideal Phase Leg” for Energy-Efficient Applications

IXYS Integrates Thyristor and IGBT to offer “Ideal Phase Leg” for Energy-Efficient Applications

new products Feb 26, 2013 by Jeff Shepard
Integrated-FET Buck DC-DCs from Micrel Provide Optimized Solution Costs For 12V Input Rails

Integrated-FET Buck DC-DCs from Micrel Provide Optimized Solution Costs For 12V Input Rails

new products Feb 26, 2013 by Jeff Shepard
Allegro Adds Innovative Package Option For Their Existing Current Sensor IC Portfolio

Allegro Adds Innovative Package Option For Their Existing Current Sensor IC Portfolio

News Feb 25, 2013 by Jeff Shepard
Texas Instruments Targets IGBT and SiC FET Designs with New Gate Drivers

Texas Instruments Targets IGBT and SiC FET Designs with New Gate Drivers

new products Feb 25, 2013 by Jeff Shepard
GeneSiC Intros High-Voltage Silicon-Carbide Junction Transistors

GeneSiC Intros High-Voltage Silicon-Carbide Junction Transistors

new products Feb 24, 2013 by Jeff Shepard
Cree and Eta to Demonstrate High-Efficiency (70%+) GaN-Based Power Amplifier for Mobile Base Stations

Cree and Eta to Demonstrate High-Efficiency (70%+) GaN-Based Power Amplifier for Mobile Base Stations

News Feb 19, 2013 by Jeff Shepard
Infineon’s 300mm Thin Wafer Fab Completes Qualification Begins Production

Infineon’s 300mm Thin Wafer Fab Completes Qualification Begins Production

News Feb 18, 2013 by Jeff Shepard