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Toshiba Launches 2.0A USB-Ready Li-Ion Charger IC that Fast Charges Portable Devices

Toshiba Launches 2.0A USB-Ready Li-Ion Charger IC that Fast Charges Portable Devices

new products Feb 05, 2013 by Jeff Shepard
TDK Offers Semiconductor-Embedded-in-Substrate Power Management Module for Smartphones and Tablets

TDK Offers Semiconductor-Embedded-in-Substrate Power Management Module for Smartphones and Tablets

new products Feb 04, 2013 by Jeff Shepard
TI Power Management Front-End Chip Targeted at ARM Cortex A15-Based Designs

TI Power Management Front-End Chip Targeted at ARM Cortex A15-Based Designs

new products Feb 03, 2013 by Jeff Shepard
Expanded Resistance Range for KOA’s Thick-Film Chip Resistors

Expanded Resistance Range for KOA’s Thick-Film Chip Resistors

new products Jan 31, 2013 by Jeff Shepard
Raytheon Achieves UK First with Opening of New Silicon-Carbide Foundry

Raytheon Achieves UK First with Opening of New Silicon-Carbide Foundry

News Jan 30, 2013 by Jeff Shepard
Allegro Adds Dual Analog/PWM Programmable Linear IC for Applications Requiring Output Redundancy

Allegro Adds Dual Analog/PWM Programmable Linear IC for Applications Requiring Output Redundancy

new products Jan 30, 2013 by Jeff Shepard
Toshiba’s Latest MOSFET Intro Adds “DPAK+” Package Suited for High-Speed Switching

Toshiba’s Latest MOSFET Intro Adds “DPAK+” Package Suited for High-Speed Switching

new products Jan 24, 2013 by Jeff Shepard
TowerJazz and OnSemi Collaborate on Programmable PMIC for LCD and AMOLED Panels

TowerJazz and OnSemi Collaborate on Programmable PMIC for LCD and AMOLED Panels

News Jan 22, 2013 by Jeff Shepard
Arctic Sand Nabs Funding to Commercialize Switched-Capacitance Power Conversion Technology

Arctic Sand Nabs Funding to Commercialize Switched-Capacitance Power Conversion Technology

News Jan 16, 2013 by Jeff Shepard
ROHM Adds Wide-Terminal Low-Ohmic Chip Resistors for Current Detection

ROHM Adds Wide-Terminal Low-Ohmic Chip Resistors for Current Detection

new products Jan 16, 2013 by Jeff Shepard
UMC Adds Thick-Plated Copper for PMICs—Developed with Chipbond

UMC Adds Thick-Plated Copper for PMICs—Developed with Chipbond

News Jan 14, 2013 by Jeff Shepard
Toshiba Launches Low RDS(on) Power MOSFET for Automotive Applications

Toshiba Launches Low RDS(on) Power MOSFET for Automotive Applications

new products Jan 14, 2013 by Jeff Shepard
Microsemi Expands SiC Power Module Product Family in Industrial and Extended Temperature Ranges

Microsemi Expands SiC Power Module Product Family in Industrial and Extended Temperature Ranges

new products Jan 14, 2013 by Jeff Shepard
Concept Opens Design Center in Ense to Develop High-Performance Custom IGBT Driver Solutions

Concept Opens Design Center in Ense to Develop High-Performance Custom IGBT Driver Solutions

News Jan 13, 2013 by Jeff Shepard
Precision Thin Film Chip Resistor Arrays Offer Tolerances As Low As 0.1%

Precision Thin Film Chip Resistor Arrays Offer Tolerances As Low As 0.1%

new products Jan 08, 2013 by Jeff Shepard
Power Electronics Companies to Watch in 2013

Power Electronics Companies to Watch in 2013

News Jan 07, 2013 by Power Pulse1595211359
Digi-Key/GeneSiC Pen Global Distribution Agreement

Digi-Key/GeneSiC Pen Global Distribution Agreement

News Jan 07, 2013 by Jeff Shepard
Toshiba IGBT/MOSFET Gate Drive Photocoupler Features 500ns Propagation Delay

Toshiba IGBT/MOSFET Gate Drive Photocoupler Features 500ns Propagation Delay

new products Jan 07, 2013 by Jeff Shepard
MagnaChip to Offer Next-Generation 0.35um High-Voltage BCD Technology

MagnaChip to Offer Next-Generation 0.35um High-Voltage BCD Technology

News Jan 06, 2013 by Jeff Shepard
50 Most-Read Power Electronics Stories of 2012: 50 to 41

50 Most-Read Power Electronics Stories of 2012: 50 to 41

News Dec 27, 2012 by Power Pulse1595211359