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IXYS to Acquire 4- and 8-Bit Microcontroller Business from Samsung

IXYS to Acquire 4- and 8-Bit Microcontroller Business from Samsung


News May 24, 2013 by Jeff Shepard
Infineon Offers Early Samples of Next-Gen of HV IGBT Gate Drivers for EVs and HEVs

Infineon Offers Early Samples of Next-Gen of HV IGBT Gate Drivers for EVs and HEVs

Automotive MCU Integrates Digital Power Supply System Functions onto a Single Chip

Automotive MCU Integrates Digital Power Supply System Functions onto a Single Chip

Renesas New USB 2.0 Hub Controller Chip Supports Battery Rapid Charging

Renesas New USB 2.0 Hub Controller Chip Supports Battery Rapid Charging

Advanced Internal Structure of New MOSFET Family Lowers On-State Resistance

Advanced Internal Structure of New MOSFET Family Lowers On-State Resistance

EPC Opens GaN Power Library - Aims to Accelerate Adoption

EPC Opens GaN Power Library - Aims to Accelerate Adoption


News May 20, 2013 by Jeff Shepard
TDK Intros Multilayer Chip Beads that are 80% Smaller in Volume and 65% in Area

TDK Intros Multilayer Chip Beads that are 80% Smaller in Volume and 65% in Area

European Project Reports Achievements in Drive to Shape the Future of Power Microelectronics

European Project Reports Achievements in Drive to Shape the Future of Power Microelectronics


News May 15, 2013 by Jeff Shepard
SiC and GaN Again a Major Focus at PCIM Europe

SiC and GaN Again a Major Focus at PCIM Europe

Best Paper and Three Young Engineer Awards Presented during PCIM Opening Ceremony

Best Paper and Three Young Engineer Awards Presented during PCIM Opening Ceremony

SiC Modules, IGBTs and Super-Junction MOSFETs Introduced on Day One of PCIM

SiC Modules, IGBTs and Super-Junction MOSFETs Introduced on Day One of PCIM

Teledyne Acquires Axiom IC

Teledyne Acquires Axiom IC


News May 12, 2013 by Jeff Shepard
Gate Drive Optocouplers  for High-Speed SiC FETs Deliver up to 2.5A

Gate Drive Optocouplers for High-Speed SiC FETs Deliver up to 2.5A

Gallium-Nitride-on-Silicon Devices from IR in Home Theater System

Gallium-Nitride-on-Silicon Devices from IR in Home Theater System


News May 08, 2013 by Jeff Shepard
Vicor’s ChiP Power Component Packaging Technology to Make European Debut at PCIM

Vicor’s ChiP Power Component Packaging Technology to Make European Debut at PCIM

Kopin Acquires Majority Stake in Low-Power Mixed-Signal IC Design Company e-MDT

Kopin Acquires Majority Stake in Low-Power Mixed-Signal IC Design Company e-MDT


News May 05, 2013 by Jeff Shepard
Infineon Uses Co-Developed TO 247-4 Four-Pin Package for CoolMOS Power FETs

Infineon Uses Co-Developed TO 247-4 Four-Pin Package for CoolMOS Power FETs

New Method Joins GaN and Diamond for Better Thermal Management

New Method Joins GaN and Diamond for Better Thermal Management


News May 02, 2013 by Jeff Shepard
Europeans Establish Dueling Projects to Advance Power Electronics Technologies

Europeans Establish Dueling Projects to Advance Power Electronics Technologies


News Apr 30, 2013 by Jeff Shepard
Quad-MOSFET Boosts Efficiency / Eliminates Heat Sinking in Active Bridge Applications

Quad-MOSFET Boosts Efficiency / Eliminates Heat Sinking in Active Bridge Applications