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600-V GaN FET Power Stage

600-V GaN FET Power Stage

Increased Packing Density From Double-Sided Power Semiconductor Cooling

Increased Packing Density From Double-Sided Power Semiconductor Cooling

This article discusses the method of increasing packing density of power electronics using Chip-on-Heatsink Technology for better thermal management.


Mie Fujitsu and CSEM partner on Sub-Threshold Technology for IoT

Mie Fujitsu and CSEM partner on Sub-Threshold Technology for IoT


News Apr 21, 2016 by Jeff Shepard
Thermal Management Materials for SiC and GaN Devices

Thermal Management Materials for SiC and GaN Devices

Groundbreaking for Construction of ams New York Fab

Groundbreaking for Construction of ams New York Fab


News Apr 20, 2016 by Jeff Shepard
1500-kW RF Power Transistor sets New Benchmark

1500-kW RF Power Transistor sets New Benchmark

MPAC-Doherty devices Support GaN PA Frequencies

MPAC-Doherty devices Support GaN PA Frequencies

AIX G5+ C Qualified for Production of imec GaN-on-Si Materials

AIX G5+ C Qualified for Production of imec GaN-on-Si Materials


News Apr 18, 2016 by Jeff Shepard
USCi and Elettromeccanica ECC SpAto sign Distribution Agreement

USCi and Elettromeccanica ECC SpAto sign Distribution Agreement

United Silicon Carbide Inc. (USCi) a leading manufacturer for SiC devices located in Monmouth Junction, New Jersey announces a distribution…


Innovation Award 2016 and the Young Engineer Award

Innovation Award 2016 and the Young Engineer Award

The jury has decided to give the SEMIKRON Innovation Award 2016 to a researcher team from Erlangen for its innovation on 'Zero Tolerance -…


new products Apr 17, 2016 by SEMIKRON
IX2120B Drives Both High Side and Low Side IGBTs or MOSFETs

IX2120B Drives Both High Side and Low Side IGBTs or MOSFETs

IXYS Integrated Circuits Division (ICD), Inc., a wholly owned subsidiary of IXYS Corporation (NASDAQ: IXYS), announced the immediate availability…


new products Apr 17, 2016 by IXYS
650V GaN 2kW Half-Bridge Evaluation Board

650V GaN 2kW Half-Bridge Evaluation Board


News Apr 13, 2016 by Jeff Shepard
Freebird and EPC partner on Rad-Hard GaN Power Conversion

Freebird and EPC partner on Rad-Hard GaN Power Conversion


News Apr 13, 2016 by Jeff Shepard
GaN RF Devices Demonstrate Reliability in Space Environments

GaN RF Devices Demonstrate Reliability in Space Environments


News Apr 13, 2016 by Jeff Shepard
Opto-Isolated IGBT Gate Pre-Driver IC for In-Vehicle Inverters

Opto-Isolated IGBT Gate Pre-Driver IC for In-Vehicle Inverters

IC supports USB Power Delivery 2.0 and 3.0 Specifications

IC supports USB Power Delivery 2.0 and 3.0 Specifications

Dimmable LED Driver IC with 650V MOSFET and PFC

Dimmable LED Driver IC with 650V MOSFET and PFC

Two-Dimensional Replacement proposed for Silicon Devices

Two-Dimensional Replacement proposed for Silicon Devices


News Apr 11, 2016 by Jeff Shepard
3rd Gen SiC SBDs, Full SiC Modules, and Arduino Shield for Stepper Motors

3rd Gen SiC SBDs, Full SiC Modules, and Arduino Shield for Stepper Motors

Innova Macroprocessors

Innova Macroprocessors

This article introduces SPCO's Innova Macroprocessor, a solid-state, scalable power module sourcing optical signals to trigger control circuits.