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Cypress Semi announces Multiple IoT Investments

Cypress Semi announces Multiple IoT Investments

News May 01, 2016 by Jeff Shepard
Reference Design for Inverters: First integrated solution for e-mobility and industry

Reference Design for Inverters: First integrated solution for e-mobility and industry

This article discusses the TDK and Infineon's new integrated solution for inverters for e-mobility power trains and industrial applications.

Technical Articles May 01, 2016 by Wolfgang Rambow
28V 30W GaN HEMT Die now Available

28V 30W GaN HEMT Die now Available

new products Apr 28, 2016 by Jeff Shepard
Dimming Interface IC reduces Components up to 70%

Dimming Interface IC reduces Components up to 70%

new products Apr 28, 2016 by Jeff Shepard
GaN Transistors in Inverters, Motors, and Power Modules

GaN Transistors in Inverters, Motors, and Power Modules

News Apr 27, 2016 by Power Pulse1595211359
Wolfspeed SiC MOSFETs, Schottkys and Modules

Wolfspeed SiC MOSFETs, Schottkys and Modules

News Apr 27, 2016 by Power Pulse1595211359
IGBT Enhances Energy Efficiency in Inverters

IGBT Enhances Energy Efficiency in Inverters

new products Apr 27, 2016 by Jeff Shepard
MACOM Sues Infineon over GaN Technology

MACOM Sues Infineon over GaN Technology

News Apr 26, 2016 by Jeff Shepard
DC-DC Converters can Drive SiC MOSFETs

DC-DC Converters can Drive SiC MOSFETs

new products Apr 26, 2016 by Jeff Shepard
Six Videos Featuring GaN Technology Applications

Six Videos Featuring GaN Technology Applications

News Apr 25, 2016 by Jeff Shepard
LED Driver Provides Single Chip TRIAC and Digital Dimming

LED Driver Provides Single Chip TRIAC and Digital Dimming

new products Apr 25, 2016 by Jeff Shepard
Reverse-blocking, pFET Integrated Power Controllers

Reverse-blocking, pFET Integrated Power Controllers

new products Apr 25, 2016 by Jeff Shepard
Thick-Film, Multi-Resistance-Value Chip Resistor Arrays

Thick-Film, Multi-Resistance-Value Chip Resistor Arrays

new products Apr 25, 2016 by Jeff Shepard
600-V GaN FET Power Stage

600-V GaN FET Power Stage

new products Apr 24, 2016 by Jeff Shepard
Increased Packing Density From Double-Sided Power Semiconductor Cooling

Increased Packing Density From Double-Sided Power Semiconductor Cooling

This article discusses the method of increasing packing density of power electronics using Chip-on-Heatsink Technology for better thermal management.

Technical Articles Apr 22, 2016 by Roland Dische
Mie Fujitsu and CSEM partner on Sub-Threshold Technology for IoT

Mie Fujitsu and CSEM partner on Sub-Threshold Technology for IoT

News Apr 21, 2016 by Jeff Shepard
Thermal Management Materials for SiC and GaN Devices

Thermal Management Materials for SiC and GaN Devices

new products Apr 21, 2016 by Jeff Shepard
Groundbreaking for Construction of ams New York Fab

Groundbreaking for Construction of ams New York Fab

News Apr 20, 2016 by Jeff Shepard
1500-kW RF Power Transistor sets New Benchmark

1500-kW RF Power Transistor sets New Benchmark

new products Apr 19, 2016 by Jeff Shepard
MPAC-Doherty devices Support GaN PA Frequencies

MPAC-Doherty devices Support GaN PA Frequencies

new products Apr 19, 2016 by Jeff Shepard