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Consortium to address Wafer-Level Packaging Challenges

Consortium to address Wafer-Level Packaging Challenges


News Jun 29, 2016 by Jeff Shepard
ABB opens Silicon Valley Campus with IoTSP Focus

ABB opens Silicon Valley Campus with IoTSP Focus


News Jun 29, 2016 by Jeff Shepard
Bluetooth Low Energy Single-Chip Solution

Bluetooth Low Energy Single-Chip Solution

Battery-Charger IC Reduces Cost and Time-to-Market

Battery-Charger IC Reduces Cost and Time-to-Market

Three-Wire True Zero-Speed Magnetic Speed-Sensor IC

Three-Wire True Zero-Speed Magnetic Speed-Sensor IC

High-Quality / Large-Diameter GaN Substrates

High-Quality / Large-Diameter GaN Substrates


News Jun 22, 2016 by Jeff Shepard
2.38 mOhm Dual MOSFET for Battery Protection

2.38 mOhm Dual MOSFET for Battery Protection

3D Silicon Lithium-Ion Battery in Pilot Production

3D Silicon Lithium-Ion Battery in Pilot Production


News Jun 21, 2016 by Jeff Shepard
25A / 650V Hermetic SiC FETs handle 225 Degrees C

25A / 650V Hermetic SiC FETs handle 225 Degrees C

12mm2 60V N-channel Power MOSFET with Low On-Resistance

12mm2 60V N-channel Power MOSFET with Low On-Resistance

Texas Instruments introduces a new 60-V N-channel FemtoFET power transistor that provides the industry’s lowest resistance


1.2-mm² 60-V 54mΩ N-channel MOSFET

1.2-mm² 60-V 54mΩ N-channel MOSFET

Delivering first SiC Intelligent Power Modules to Thales

Delivering first SiC Intelligent Power Modules to Thales

This article discusses the announcement of the delivery of the CISSOID's first prototype of 3-phase 1200V/100A SiC MOSFET IPMs to Thales…


new products Jun 16, 2016 by CISSOID
0.13µm Process improves ESD Characteristics

0.13µm Process improves ESD Characteristics


News Jun 15, 2016 by Jeff Shepard
Two New Drivers for Automotive Brushless DC Motors

Two New Drivers for Automotive Brushless DC Motors

Texas Instruments introduces two new automotive motor drivers that support high-performance powertrain applications.


Enhanced IGBT Module Power Density Utilizing the Improved Thermal Conductivity of SLC-Technology

Enhanced IGBT Module Power Density Utilizing the Improved Thermal Conductivity of SLC-Technology

This article introduces the new IGBT module generation of Mitsubishi Electric with improved Insulated Metal Baseplate as a key element of the…


WPG Americas pens Distribution Agreement with Seoul Semiconductor

WPG Americas pens Distribution Agreement with Seoul Semiconductor


News Jun 14, 2016 by Jeff Shepard
Brushless DC Motor Drivers for Automotive Powertrains

Brushless DC Motor Drivers for Automotive Powertrains

GaAs Voltage Regulators to be Packaged in 3D SIPs

GaAs Voltage Regulators to be Packaged in 3D SIPs


News Jun 13, 2016 by Jeff Shepard
Keeping Cool with a Black Semiconductor

Keeping Cool with a Black Semiconductor


News Jun 13, 2016 by Jeff Shepard
Laminated Busbar Enabling High Frequency High Voltage and High Temperature Electronics

Laminated Busbar Enabling High Frequency High Voltage and High Temperature Electronics

Mersen presented its unique solution to get the best of the 2 worlds: high T° (up to 200°C) and low inductance laminated busbar for power module…


new products Jun 13, 2016 by Mersen