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An Introduction to Utilizing the AVSBus Interface in Power Design

An Introduction to Utilizing the AVSBus Interface in Power Design

This article discusses the advantages and benefits of AVSBus, a protocol for DVFS for faster clock speed and lesser switching losses.

Technical Articles Aug 16, 2016 by Robert V White
GaN Powers Next-Generation Missile Defense

GaN Powers Next-Generation Missile Defense

News Aug 15, 2016 by Jeff Shepard
Evaluating Silver Sintering as a Reliable Die-Attach Material for Automotive Power Module Applications

Evaluating Silver Sintering as a Reliable Die-Attach Material for Automotive Power Module Applications

This article discusses the benefits of double-sided silver-sintering technology and demonstrate the superiority over conventional solder.

Technical Articles Aug 11, 2016 by Gustavo Greca
Introduction of a Wireless Multi-Mode Demonstration System

Introduction of a Wireless Multi-Mode Demonstration System

This article introduces Efficient Power Conversion Corporation's EPC9121, a 10W multi-mode wireless power charging kit for power charging…

new products Aug 09, 2016 by EPC
Collaborative Approach to Overhaul Motor Inverters

Collaborative Approach to Overhaul Motor Inverters

This article discusses approaches to overhaul motor inverters.

tech insights Aug 09, 2016 by Neil Markham
Buck/Boost Controller with Integrated Buck FET

Buck/Boost Controller with Integrated Buck FET

new products Aug 08, 2016 by Jeff Shepard
LDOs in Breakthrough Bumpless Chip-Scale Package

LDOs in Breakthrough Bumpless Chip-Scale Package

new products Aug 04, 2016 by Jeff Shepard
High-Speed Multi-Channel PLC Input Isolators

High-Speed Multi-Channel PLC Input Isolators

new products Aug 03, 2016 by Jeff Shepard
1500V Super-Junction FET in TO-220FP Wide-Creepage Package

1500V Super-Junction FET in TO-220FP Wide-Creepage Package

new products Aug 02, 2016 by Jeff Shepard
Mouser Signs Global Agreement with Torex Semiconductor

Mouser Signs Global Agreement with Torex Semiconductor

News Aug 01, 2016 by Jeff Shepard
Process Qualified for AEC-Q100 Grade-0 Automotive PMICs

Process Qualified for AEC-Q100 Grade-0 Automotive PMICs

new products Aug 01, 2016 by Jeff Shepard
Anti-Surge Thick Film Chip Resistors

Anti-Surge Thick Film Chip Resistors

new products Jul 31, 2016 by Jeff Shepard
Increasing Reliability Data for GaN Devices

Increasing Reliability Data for GaN Devices

new products Jul 31, 2016 by Jeff Shepard
New Material may Exceed GaN Performance

New Material may Exceed GaN Performance

News Jul 28, 2016 by Jeff Shepard
DrMOS Modules Optimized for High-Density Designs

DrMOS Modules Optimized for High-Density Designs

new products Jul 28, 2016 by Jeff Shepard
Gate Drivers for IGBTs and SiC MOSFETs

Gate Drivers for IGBTs and SiC MOSFETs

new products Jul 28, 2016 by Jeff Shepard
Taiyo Yuden gets GE IP for Si, SiC and GaN Embedded Circuits

Taiyo Yuden gets GE IP for Si, SiC and GaN Embedded Circuits

News Jul 27, 2016 by Jeff Shepard
Running out of Power for Data Centers

Running out of Power for Data Centers

News Jul 27, 2016 by Jeff Shepard
High-Reliability SCALE2 Driver Technology to 1200 V Applications

High-Reliability SCALE2 Driver Technology to 1200 V Applications

Power Integrations announced a family of galvanically isolated single-channel gate driver ICs ranging in output current from 2.5 A to 8 A

new products Jul 26, 2016 by Power Integrations
LinPak, the Standard Expands to 3300V and Shows Excellent Parallel Operation as well as SiC Readiness

LinPak, the Standard Expands to 3300V and Shows Excellent Parallel Operation as well as SiC Readiness

This article presents general module design considerations and first results on switching characteristics of LinPaks in different configurations.

Technical Articles Jul 26, 2016 by Raffael Schnell