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Anti-Surge Thick Film Chip Resistors

Anti-Surge Thick Film Chip Resistors

new products Jul 31, 2016 by Jeff Shepard
Increasing Reliability Data for GaN Devices

Increasing Reliability Data for GaN Devices

new products Jul 31, 2016 by Jeff Shepard
New Material may Exceed GaN Performance

New Material may Exceed GaN Performance

News Jul 28, 2016 by Jeff Shepard
DrMOS Modules Optimized for High-Density Designs

DrMOS Modules Optimized for High-Density Designs

new products Jul 28, 2016 by Jeff Shepard
Gate Drivers for IGBTs and SiC MOSFETs

Gate Drivers for IGBTs and SiC MOSFETs

new products Jul 28, 2016 by Jeff Shepard
Taiyo Yuden gets GE IP for Si, SiC and GaN Embedded Circuits

Taiyo Yuden gets GE IP for Si, SiC and GaN Embedded Circuits

News Jul 27, 2016 by Jeff Shepard
Running out of Power for Data Centers

Running out of Power for Data Centers

News Jul 27, 2016 by Jeff Shepard
High-Reliability SCALE2 Driver Technology to 1200 V Applications

High-Reliability SCALE2 Driver Technology to 1200 V Applications

Power Integrations announced a family of galvanically isolated single-channel gate driver ICs ranging in output current from 2.5 A to 8 A

new products Jul 26, 2016 by Power Integrations
LinPak, the Standard Expands to 3300V and Shows Excellent Parallel Operation as well as SiC Readiness

LinPak, the Standard Expands to 3300V and Shows Excellent Parallel Operation as well as SiC Readiness

This article presents general module design considerations and first results on switching characteristics of LinPaks in different configurations.

Technical Articles Jul 26, 2016 by Raffael Schnell
EPC taps Ismosys to Support Accelerating European GaN Growth

EPC taps Ismosys to Support Accelerating European GaN Growth

News Jul 25, 2016 by Jeff Shepard
Takaki Murata named HPA VP and GM at Peregrine Semi

Takaki Murata named HPA VP and GM at Peregrine Semi

News Jul 25, 2016 by Jeff Shepard
Kettering tapped to Develop SiC EV Charger for PowerAmerica

Kettering tapped to Develop SiC EV Charger for PowerAmerica

News Jul 20, 2016 by Jeff Shepard
Hua Hong Semi targets NEVs with FS IGBT Expertise

Hua Hong Semi targets NEVs with FS IGBT Expertise

News Jul 19, 2016 by Jeff Shepard
Power Electronics Featured at 2016 IEEE IEDM

Power Electronics Featured at 2016 IEEE IEDM

News Jul 19, 2016 by Jeff Shepard
1200V SiC MOSFET in SOT227 MiniBLOC

1200V SiC MOSFET in SOT227 MiniBLOC

new products Jul 19, 2016 by Jeff Shepard
Operating SiC Power Devices at 300 Degrees C

Operating SiC Power Devices at 300 Degrees C

News Jul 18, 2016 by Jeff Shepard
Illumination LED Driver IC with Single-Wire Input

Illumination LED Driver IC with Single-Wire Input

new products Jul 18, 2016 by Jeff Shepard
Compact H-Bridge Driver IC for Low-Voltage 25V Drives

Compact H-Bridge Driver IC for Low-Voltage 25V Drives

Toshiba Electronics Europe has announced an addition to its range of H-bridge [1] driver ICs for brushed DC and stepper motors

new products Jul 17, 2016 by Toshiba Europe
Lifetime Analysis of PrimePACK™ Modules with IGBT5 and .XT

Lifetime Analysis of PrimePACK™ Modules with IGBT5 and .XT

This article introduces Infineon Technologies'novel joinging technology .XT for PrimePack power modules and it's advantages over…

Technical Articles Jul 17, 2016 by Wilhelm Rusche
EPC and ASD Form Value-added GaN Partnership

EPC and ASD Form Value-added GaN Partnership

News Jul 14, 2016 by Jeff Shepard