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TRIAC Dimmable LED Driver ICs Cut BOM Count by 40

TRIAC Dimmable LED Driver ICs Cut BOM Count by 40

This article introduces Power Integrations' LYTSwitch-7, a single-stage, non-isolated, TRIAC dimmable, buck topology LED driver IC.

new products Sep 02, 2016 by Power Integrations
Relay Driver IC with Integrated ARM Cortex M0 Core

Relay Driver IC with Integrated ARM Cortex M0 Core

new products Sep 01, 2016 by Jeff Shepard
Renesas and TSMC Collaborating on 28nm Automotive MCUs

Renesas and TSMC Collaborating on 28nm Automotive MCUs

News Aug 31, 2016 by Jeff Shepard
EpiGaN Expanding into Asia with ACAPITAL Investment

EpiGaN Expanding into Asia with ACAPITAL Investment

News Aug 29, 2016 by Jeff Shepard
GaN Systems’ Founders Girvan Patterson and John Roberts to Retire

GaN Systems’ Founders Girvan Patterson and John Roberts to Retire

News Aug 25, 2016 by Jeff Shepard
Dialog Semi Enters GaN Power IC Market

Dialog Semi Enters GaN Power IC Market

News Aug 24, 2016 by Jeff Shepard
TI enters Strategic Relationship with Silicon Catalyst

TI enters Strategic Relationship with Silicon Catalyst

News Aug 24, 2016 by Jeff Shepard
Silicon may Replace Graphite in Li-ions

Silicon may Replace Graphite in Li-ions

News Aug 24, 2016 by Jeff Shepard
IPM with SiC Boost Diode for 150kHz Operation

IPM with SiC Boost Diode for 150kHz Operation

new products Aug 21, 2016 by Jeff Shepard
LYTSwitch-1 LED Driver ICs Reduce Complexity in Bulbs Tubes and Ballasts up to 22 W

LYTSwitch-1 LED Driver ICs Reduce Complexity in Bulbs Tubes and Ballasts up to 22 W

Power Integrations announced its LYTSwitch™-1 single-stage, non-isolated, buck topology LED driver IC family

new products Aug 19, 2016 by Power Integrations
Mitsubishi Launches Super-mini Full SiC DIPIPM

Mitsubishi Launches Super-mini Full SiC DIPIPM

new products Aug 18, 2016 by Jeff Shepard
DC Link Film Capacitor for New IGBT Modules

DC Link Film Capacitor for New IGBT Modules

new products Aug 17, 2016 by Jeff Shepard
1-GHz Optically-Isolated Measurements for GaN and SiC

1-GHz Optically-Isolated Measurements for GaN and SiC

new products Aug 16, 2016 by Jeff Shepard
An Introduction to Utilizing the AVSBus Interface in Power Design

An Introduction to Utilizing the AVSBus Interface in Power Design

This article discusses the advantages and benefits of AVSBus, a protocol for DVFS for faster clock speed and lesser switching losses.

Technical Articles Aug 16, 2016 by Robert V White
GaN Powers Next-Generation Missile Defense

GaN Powers Next-Generation Missile Defense

News Aug 15, 2016 by Jeff Shepard
Evaluating Silver Sintering as a Reliable Die-Attach Material for Automotive Power Module Applications

Evaluating Silver Sintering as a Reliable Die-Attach Material for Automotive Power Module Applications

This article discusses the benefits of double-sided silver-sintering technology and demonstrate the superiority over conventional solder.

Technical Articles Aug 11, 2016 by Gustavo Greca
Introduction of a Wireless Multi-Mode Demonstration System

Introduction of a Wireless Multi-Mode Demonstration System

This article introduces Efficient Power Conversion Corporation's EPC9121, a 10W multi-mode wireless power charging kit for power charging…

new products Aug 09, 2016 by EPC
Collaborative Approach to Overhaul Motor Inverters

Collaborative Approach to Overhaul Motor Inverters

This article discusses approaches to overhaul motor inverters.

tech insights Aug 09, 2016 by Neil Markham
Buck/Boost Controller with Integrated Buck FET

Buck/Boost Controller with Integrated Buck FET

new products Aug 08, 2016 by Jeff Shepard
LDOs in Breakthrough Bumpless Chip-Scale Package

LDOs in Breakthrough Bumpless Chip-Scale Package

new products Aug 04, 2016 by Jeff Shepard