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Low-Power Cost-Optimized FPGAs for IoT

Low-Power Cost-Optimized FPGAs for IoT

GaNonCMOS Project Aims for GaN Commercialization

GaNonCMOS Project Aims for GaN Commercialization


News Feb 14, 2017 by Jeff Shepard
Automotive Three-Phase Isolated MOSFET Driver IC

Automotive Three-Phase Isolated MOSFET Driver IC

Unidirectional Linear Hall Sensor IC in Surface-Mount Package

Unidirectional Linear Hall Sensor IC in Surface-Mount Package

This article features Allegro Microsystems' ALS31000, a unidirectional linear Hall sensor integrated circuit for automotive and industrial…


Applying Silver Low-Temperature Sintering Technology

Applying Silver Low-Temperature Sintering Technology

This article discusses the application of technologies of low-temperature sintering of silicon wafers and molybdenum discs using the silver…


High-Performance DC Circuit Breakers to 1500V

High-Performance DC Circuit Breakers to 1500V


News Feb 13, 2017 by Jeff Shepard
Unidirectional ESD Protection in 01005 Flip Chip Package

Unidirectional ESD Protection in 01005 Flip Chip Package

48W Aux. Power Supply Evaluation Board for SiC FETs

48W Aux. Power Supply Evaluation Board for SiC FETs

Unidirectional ESD Protection in a 01005 Flip Chip Package Introduced

Unidirectional ESD Protection in a 01005 Flip Chip Package Introduced

Littelfuse, Inc. introduces its new series of three unidirectional TVS diode arrays in space-saving 01005 flip-chip packages


new products Feb 13, 2017 by Littelfuse
IEDM 2016 Showcases the Latest Technology Developments in MicroNanoelectronics and Power Devices

IEDM 2016 Showcases the Latest Technology Developments in MicroNanoelectronics and Power Devices

The 62nd annual IEEE International Electron Devices Meeting, (IEDM) was held in San Francisco, California, USA December 3 - 7, 2016. For more than six


tech insights Feb 13, 2017 by Gary Dolny
GaN Transistor Gate Drive Optocouplers

GaN Transistor Gate Drive Optocouplers

This article features Broadcom's Gallium Nitride (GaN) Transistor Gate Drive Optocouplers and discusses its advantages, marketing, drive and…


NY-PEMC Fabs Initial 150mm SiC-Based Patterned Wafers

NY-PEMC Fabs Initial 150mm SiC-Based Patterned Wafers


News Feb 12, 2017 by Jeff Shepard
SiC Computer Chips for Longer Venus Surface Missions

SiC Computer Chips for Longer Venus Surface Missions


News Feb 12, 2017 by Jeff Shepard
Seven DCMs in a ChiP Package

Seven DCMs in a ChiP Package

Vicor introduces seven new DCMs in a ChiP package that generate an isolated DC output


new products Feb 10, 2017 by Vicor
Arduino Shield for Easier and Faster Stepper Motor Driver Designs

Arduino Shield for Easier and Faster Stepper Motor Driver Designs

At SPS in Nuremberg ROHM Semiconductor presented its Arduino-based evaluation kit (EVK) to support the evaluation of its motor driver devices as…


new products Feb 10, 2017 by ROHM
The Next Generation Bimode Insulated Gate Transistors Based on Enhanced Trench Technology

The Next Generation Bimode Insulated Gate Transistors Based on Enhanced Trench Technology

This article demonstrate the next step in device evolution can be achieved by combining the ET-IGBT MOS cell and the BIGT integration structure.


£4.3 Million for GaN-on-Diamond Microwave Power

£4.3 Million for GaN-on-Diamond Microwave Power


News Feb 09, 2017 by Jeff Shepard
Automotive Thin-Film Chip Caps with Low ESR and High Q

Automotive Thin-Film Chip Caps with Low ESR and High Q

First Device in Family to Implement Flexible Power Islands

First Device in Family to Implement Flexible Power Islands

Silego Technology announces the SLG46125, further expanding the GreenPAKTM (GPAK) family of Programmable Mixed-signal ICs


Semitrex Announces New Leadership to Drive Growth

Semitrex Announces New Leadership to Drive Growth


News Feb 08, 2017 by Jeff Shepard