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Himax Q4 2016 Financials Suffer from Inventory Write-Downs

Himax Q4 2016 Financials Suffer from Inventory Write-Downs


News Jan 29, 2017 by Jeff Shepard
EPC Adds Dr. Suvankar Biswas, Opens Blacksburg Apps Center

EPC Adds Dr. Suvankar Biswas, Opens Blacksburg Apps Center


News Jan 25, 2017 by Jeff Shepard
The Creation of Silicon Carbide  Revolutionary Semiconductor

The Creation of Silicon Carbide Revolutionary Semiconductor

This article highlights SiCrystal AG and Rohm Semiconductor GmbH for the potential of Silicon Carbide material for power and RF electronics…


Power Management IC Targets DDR4 NVDIMMs

Power Management IC Targets DDR4 NVDIMMs

Silicon Labs Acquires Wi-Fi Innovator Zentri

Silicon Labs Acquires Wi-Fi Innovator Zentri


News Jan 23, 2017 by Jeff Shepard
Third-Generation Super Junction Devices from Hua Hong

Third-Generation Super Junction Devices from Hua Hong


News Jan 23, 2017 by Jeff Shepard
I3C Interface Specification from MIPI Supersets I2C

I3C Interface Specification from MIPI Supersets I2C


News Jan 19, 2017 by Jeff Shepard
Innovative Glass Substrates for Semiconductor Packaging

Innovative Glass Substrates for Semiconductor Packaging


News Jan 19, 2017 by Jeff Shepard
1608mm Size Metal Alloy Chip Inductor

1608mm Size Metal Alloy Chip Inductor

Mouser Signs Global Agreement with United Silicon Carbide

Mouser Signs Global Agreement with United Silicon Carbide


News Jan 18, 2017 by Jeff Shepard
GaN Produces 5nS Pulses for High-Performance LiDAR

GaN Produces 5nS Pulses for High-Performance LiDAR


News Jan 18, 2017 by Jeff Shepard
Precision Thin-Film Tantalum Nitride Chip Resistors

Precision Thin-Film Tantalum Nitride Chip Resistors

Low-Voltage Bipolar Stepper or Dual DC Motor Driver IC

Low-Voltage Bipolar Stepper or Dual DC Motor Driver IC

MiniSKiiP: The Power Density Master for Motor Drives

MiniSKiiP: The Power Density Master for Motor Drives

This article features the MiniSKiip series as the power density master for compact motor drives in reducing cost by maximizing output power density.


0.35-micron 700V Technology with Simplified Process Flow

0.35-micron 700V Technology with Simplified Process Flow


News Jan 16, 2017 by Jeff Shepard
AirFuel Alliance Adds GaN Systems

AirFuel Alliance Adds GaN Systems


News Jan 15, 2017 by Jeff Shepard
GaN-on-Si Technology Advances towards Scalable HEMTs

GaN-on-Si Technology Advances towards Scalable HEMTs


News Jan 12, 2017 by Jeff Shepard
Gridential gets $6 Million for Silicon-Lead Batteries

Gridential gets $6 Million for Silicon-Lead Batteries


News Jan 12, 2017 by Jeff Shepard
650V SiC Schottkys Handle 70% More Surge Current

650V SiC Schottkys Handle 70% More Surge Current

Power Management IC with LIN and High-Speed CAN

Power Management IC with LIN and High-Speed CAN