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GaN Power ICs Enable the New Revolution in Power Electronics

GaN Power ICs Enable the New Revolution in Power Electronics

This article highlights Navitas Semiconductor GaN Power ICs history with power electronics technology development and advantages brought by GaN…


Over 1400V Breakdown on new GaN-on-Si Epiwafer Product

Over 1400V Breakdown on new GaN-on-Si Epiwafer Product

Akash Raises $3.1 Million for GaN-on-Diamond Technology

Akash Raises $3.1 Million for GaN-on-Diamond Technology


News Feb 01, 2018 by Paul Shepard
6.5kV Full-SiC Power Module Claims World’s Highest Power Density

6.5kV Full-SiC Power Module Claims World’s Highest Power Density


News Jan 31, 2018 by Paul Shepard
ON Semi enters Strategic Partnership with Audi

ON Semi enters Strategic Partnership with Audi


News Jan 30, 2018 by Paul Shepard
Dynex Announces UK-based Power Semi Innovation Centre

Dynex Announces UK-based Power Semi Innovation Centre


News Jan 30, 2018 by Paul Shepard
Two-Wire, Zero Speed Differential Wheel Speed-Sensor IC

Two-Wire, Zero Speed Differential Wheel Speed-Sensor IC

AEC-Q101 Qualified Dual MOSFET for Relay Drivers

AEC-Q101 Qualified Dual MOSFET for Relay Drivers

Unified Power Model for System-Level IC Design being Developed

Unified Power Model for System-Level IC Design being Developed


News Jan 24, 2018 by Paul Shepard
GaN Enables Compact 1kW Isolated Bidirectional DC-DCs

GaN Enables Compact 1kW Isolated Bidirectional DC-DCs

Porous SiC for Advanced Sensors and Supercapacitors

Porous SiC for Advanced Sensors and Supercapacitors


News Jan 23, 2018 by Paul Shepard
SDK to Re-expand Capacity for High-Grade SiC Epitaxial Wafers

SDK to Re-expand Capacity for High-Grade SiC Epitaxial Wafers


News Jan 23, 2018 by Paul Shepard
New Accu-L Series Thin Film Chip Inductors for Automotive Signal and Power Applications Released

New Accu-L Series Thin Film Chip Inductors for Automotive Signal and Power Applications Released

AVX Corporation has released a new series of thin-film multilayer chip inductors especially designed to meet demanding performance specifications…


new products Jan 23, 2018 by AVX
High Power Electronics Cleaning Requirements for Improved Efficiency and Reliability

High Power Electronics Cleaning Requirements for Improved Efficiency and Reliability

This article highlights the importance and benefits of cleaning power modules before bonding to ensure long-term reliability.


High Power Density High Performance X-Series 4500V IGBT Power Modules

High Power Density High Performance X-Series 4500V IGBT Power Modules

This article discusses the improvements, important parameters and application of the high-performance X-Series 4500V IGBT Power Modules.


Thin-Film Chip Inductors for Automotive Signal & Power

Thin-Film Chip Inductors for Automotive Signal & Power

Ultra-Low Power Consumption Voltage Detection IC with MOSFET

Ultra-Low Power Consumption Voltage Detection IC with MOSFET

IGBT Modules Sectioned NonDestructively

IGBT Modules Sectioned NonDestructively

Non-destructive sectioning of solid samples is performed by acoustic micro imaging tools, which are sometimes still referred to by their old name…


Flip-Chip Packaging Solution for Premium LED Lighting

Flip-Chip Packaging Solution for Premium LED Lighting


News Jan 18, 2018 by Paul Shepard
Peregrine Semiconductor Is Now pSemi

Peregrine Semiconductor Is Now pSemi


News Jan 17, 2018 by Paul Shepard