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Flip Chip Schottky Diode in Low-Profile WLCSP

Flip Chip Schottky Diode in Low-Profile WLCSP

new products Dec 12, 2018 by Paul Shepard
GaN-Enabled Wirelessly Powered Systems for the Home and High-Resolution LiDAR

GaN-Enabled Wirelessly Powered Systems for the Home and High-Resolution LiDAR

News Dec 12, 2018 by Paul Shepard
7th Gen NX Type Converter Inverter Brake Modules

7th Gen NX Type Converter Inverter Brake Modules

Applications such as elevator drives or servomotors have several special requirements. One on hand, high efficiency is important, while on the…

Technical Articles Dec 12, 2018 by Toshinari HiraiNarender Lakshmanan
High-Current IGBT Gate Driver with Active Miller Clamp

High-Current IGBT Gate Driver with Active Miller Clamp

new products Dec 11, 2018 by Paul Shepard
28GHz GaN Front-End Module Targets 5G Rollout

28GHz GaN Front-End Module Targets 5G Rollout

new products Dec 10, 2018 by Paul Shepard
World’s First Industrial-Grade eSIM in Wafer-Level Chip-Scale Package

World’s First Industrial-Grade eSIM in Wafer-Level Chip-Scale Package

News Dec 10, 2018 by Paul Shepard
Phase-Change Memory Now Sampling for Automotive Microcontrollers

Phase-Change Memory Now Sampling for Automotive Microcontrollers

News Dec 10, 2018 by Paul Shepard
GaN Enables 14mm-Thin 45W Wall Charger

GaN Enables 14mm-Thin 45W Wall Charger

new products Dec 07, 2018 by Paul Shepard
650V D-Mode GaN HEMTs Produced on 200mm Gan-on-Si Wafers with CMOS-Compatible Process

650V D-Mode GaN HEMTs Produced on 200mm Gan-on-Si Wafers with CMOS-Compatible Process

News Dec 06, 2018 by Paul Shepard
New Mechanism for Enhancing Reliability of SiC Power Devices Detailed at IEDM

New Mechanism for Enhancing Reliability of SiC Power Devices Detailed at IEDM

News Dec 06, 2018 by Paul Shepard
IEEE Energy Conversion Congress and Expo 2018

IEEE Energy Conversion Congress and Expo 2018

Energy Conversion Congress and Expo (ECCE)—the foremost IEEE conference in the field of electrical and electromechanical energy…

tech insights Dec 05, 2018 by Gary Dolny
High-Voltage GaN Helps Inergy Disrupt the Solar Power Generator Market

High-Voltage GaN Helps Inergy Disrupt the Solar Power Generator Market

News Dec 04, 2018 by Paul Shepard
TowerJazz and KERI Prototyping SiC FET Gate Driver IC on 0.18um SOI Platform

TowerJazz and KERI Prototyping SiC FET Gate Driver IC on 0.18um SOI Platform

News Dec 03, 2018 by Paul Shepard
UnitedSiC Adds Kelvin Connection Packages into SiC FET Offering

UnitedSiC Adds Kelvin Connection Packages into SiC FET Offering

News Dec 03, 2018 by Paul Shepard
Highly-Compact Driver for Stepper Motors up to 3.5A RMS

Highly-Compact Driver for Stepper Motors up to 3.5A RMS

new products Dec 03, 2018 by Paul Shepard
UnitedSiC Introduces Kelvin Connection Parts into UF3C FAST FET Series

UnitedSiC Introduces Kelvin Connection Parts into UF3C FAST FET Series

UnitedSiC expands its UF3C FAST Series product offering by introducing an additional range of 650 V and 1200 V high-performance silicon carbide FETs

new products Dec 03, 2018 by United Silicon Carbide
Dialog Semiconductor Introduces First Fully-Integrated Nanopower PMICs for Low-Power IoT Applications

Dialog Semiconductor Introduces First Fully-Integrated Nanopower PMICs for Low-Power IoT Applications

Dialog Semiconductor unveiled its first fully-integrated nanopower PMICs for IoT applications: the DA9070 and DA9073.

new products Nov 30, 2018 by Dialog Semiconductor
Endura Technologies and UNISOC Pen Power Management Partnership

Endura Technologies and UNISOC Pen Power Management Partnership

News Nov 29, 2018 by Paul Shepard
Long Life Fan-To-Heatsink IC Cooler

Long Life Fan-To-Heatsink IC Cooler

new products Nov 29, 2018 by Paul Shepard
EPC Expands Asian Team to Support Accelerating GaN Growth

EPC Expands Asian Team to Support Accelerating GaN Growth

News Nov 28, 2018 by Paul Shepard