Ferdinand-Braun-Institut (FBH), SweGaN AB, and the University of Bristol are partnering to design and manufacture new spaceborne devices.
Ferdinand-Braun-Institut (FBH), SweGaN AB, and the University of Bristol are partnering to design and manufacture new spaceborne devices.
Lithium-Ion batteries (LIBs) are highly important to the ever-evolving electronic market, powering systems from…
Lithium-Ion batteries (LIBs) are highly important to the ever-evolving electronic market, powering systems from cellphones and laptops, all the way…
This article highlights Monolithic Power Systems flyback adapter design with synchronous rectification (SR) as different…
This article highlights Monolithic Power Systems flyback adapter design with synchronous rectification (SR) as different from conventional set-ups…
Silicon Labs will sell its infrastructure and automotive unit for $2.75 billion, redirecting growth targets towards its…
Silicon Labs will sell its infrastructure and automotive unit for $2.75 billion, redirecting growth targets towards its IoT and wireless…
The expanded portfolio of intelligent power modules (IPM) includes two liquid cooled devices
The expanded portfolio of intelligent power modules (IPM) includes two liquid cooled devices
The Japanese semiconductor company appointed a new president for its European division.
The Japanese semiconductor company appointed a new president for its European division.
This article highlights Avnet Silica devices featuring STSiC Power components for SiC information.
This article highlights Avnet Silica devices featuring STSiC Power components for SiC information.
The new additions to the 600V CooMOS S7 family are aimed at high power, low frequency product designs
The new additions to the 600V CooMOS S7 family are aimed at high power, low frequency product designs
Oxford Instruments Plasma Technology and LayTec have announced a new partnership focusing on the development of compound…
Oxford Instruments Plasma Technology and LayTec have announced a new partnership focusing on the development of compound semiconductor technologies.
The new units are designed to deliver 98% full-load efficiency for applications drawing between 75 and 400 watts
The new units are designed to deliver 98% full-load efficiency for applications drawing between 75 and 400 watts
II-VI establishes its new backend processing line for conductive SiC substrates in Fuzhou, China.
II-VI establishes its new backend processing line for conductive SiC substrates in Fuzhou, China.
Infineon’s Virtual Power Conference, held May 4–6, will feature live expert panels and product demos showcasing the…
Infineon’s Virtual Power Conference, held May 4–6, will feature live expert panels and product demos showcasing the company’s latest energy…
This article highlights EPC EPC2001C and EPC2053 temperature cycling results.
This article highlights EPC EPC2001C and EPC2053 temperature cycling results.
The new power package integrates two 650V GaN power transistors with optimized gate drivers and circuit protection.
The new power package integrates two 650V GaN power transistors with optimized gate drivers and circuit protection.
The new components are said to be the first that are both sulfur-resistant and AEC-Q100 compliant
The new components are said to be the first that are both sulfur-resistant and AEC-Q100 compliant
This article highlights Flex BMR685’s power-handling capabilities make it well-suited to these high-power RF Power…
This article highlights Flex BMR685’s power-handling capabilities make it well-suited to these high-power RF Power Amplifier applications, for…
Scientists from the Nagoya Institute of Technology (NITech) have conducted innovative research about the role of…
Scientists from the Nagoya Institute of Technology (NITech) have conducted innovative research about the role of impurities in Gallium Nitride…
Dutch semiconductor manufacturer Nexperia teams up with China’s United Automotive Electronic Systems Co. on a new…
Dutch semiconductor manufacturer Nexperia teams up with China’s United Automotive Electronic Systems Co. on a new program to develop GaN-based…
This year, Key Foundry’s newly developed Gen3 0.18-micron BCD process and its Gen2 0.13 micron embedded flash process…
This year, Key Foundry’s newly developed Gen3 0.18-micron BCD process and its Gen2 0.13 micron embedded flash process will be used for mass…
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