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Configurable Mixed-Signal ICs with In-System-Programming

Configurable Mixed-Signal ICs with In-System-Programming

Trends in Electromagnetic Component Design: Why You Shouldn’t Underestimate Magnetic Technology

Trends in Electromagnetic Component Design: Why You Shouldn’t Underestimate Magnetic Technology

This article describes the advancements on the electromagnetic components' designs, analysis, simulations, cores and wires


Enargy Power signs Distribution Agreement with WPG Americas

Enargy Power signs Distribution Agreement with WPG Americas


News Jan 16, 2018 by Paul Shepard
Accelerating Custom Capacitor Design with Simulation Applications

Accelerating Custom Capacitor Design with Simulation Applications

This article highlights how simulation apps can help evaluate the effects of heat in capacitors and optimize custom capacitor design.


Wet Tantalum Caps Operate to 200 Degrees C with 1,000 Hour Life

Wet Tantalum Caps Operate to 200 Degrees C with 1,000 Hour Life

48-Volt System enables Zero-Emission Coasting at up to 100 MPH

48-Volt System enables Zero-Emission Coasting at up to 100 MPH


News Jan 15, 2018 by Paul Shepard
Utilizing the Programmable Ramp Generator on 8bit PICMCUs with MPLAB

Utilizing the Programmable Ramp Generator on 8bit PICMCUs with MPLAB

The Programmable Ramp Generator (PRG), featured on several recent 8-bit PIC microcontrollers from Microchip Technology, is a highly flexible…


IPM Cost Benchmarks

IPM Cost Benchmarks

This article describes the benefits of using highly integrated intelligent power modules which reduces size and assembly time on embedded drive…


PSMA Announces First Power Supply Reliability Survey

PSMA Announces First Power Supply Reliability Survey


News Jan 13, 2018 by Paul Shepard
Lead-type MLCCs for Automotive Designs at 175°C and 200°C

Lead-type MLCCs for Automotive Designs at 175°C and 200°C

Carnegie Mellon Extends Research into 3D Micro-Additive Manufacturing

Carnegie Mellon Extends Research into 3D Micro-Additive Manufacturing


News Jan 11, 2018 by Paul Shepard
Nano Dimension and Techniplas Partner on 3D Printing for Automotive Electronics

Nano Dimension and Techniplas Partner on 3D Printing for Automotive Electronics


News Jan 11, 2018 by Paul Shepard
Next Generation Silicon Carbide Power Device with 3DSiC Technology

Next Generation Silicon Carbide Power Device with 3DSiC Technology

Ascatron provides next generation Silicon Carbide (SiC) power semiconductors using its proprietary 3DSiC® technology with a quality and…


new products Jan 11, 2018 by Ascatron
Evaluating Inverter Drive Systems with Highspeed Multichannel Waveform Recordings

Evaluating Inverter Drive Systems with Highspeed Multichannel Waveform Recordings

This article highlights the features and advantages of Hioki E.E. Corporation's Memory HiCorder MR6000 which can reach sampling speed of 200MS/s.


Dynex Launches High-Voltage Semiconductor Foundry Business

Dynex Launches High-Voltage Semiconductor Foundry Business


News Jan 10, 2018 by Paul Shepard
High-Voltage Multi-Channel Solenoid and Unipolar Motor Driver IC

High-Voltage Multi-Channel Solenoid and Unipolar Motor Driver IC

Toshiba Electronics Europe (TEE) announced the launch of a multi-channel solenoid and unipolar motor driver IC (TB67S111PG) that delivers…


72V Hybrid Step-Down DC-DC Controller Reduces Solution Size by 50%

72V Hybrid Step-Down DC-DC Controller Reduces Solution Size by 50%

28nm FD-SOI Platform Claims Best-in-Class Energy Efficiency

28nm FD-SOI Platform Claims Best-in-Class Energy Efficiency


News Jan 09, 2018 by Paul Shepard
IC Process with Ultra-High Breakdown Voltage for Digital Isolators

IC Process with Ultra-High Breakdown Voltage for Digital Isolators


News Jan 08, 2018 by Paul Shepard
Extending 48V Cool-Power ZVS Buck Regulators Family

Extending 48V Cool-Power ZVS Buck Regulators Family

Vicor has extended the Cool-Power 48V ZVS 20A Buck Regulator portfolio by releasing the PI3523-00-LGIZ (PI3523)


new products Jan 08, 2018 by Vicor