This article highlights PREMO Group launched the 3DPower™ as the first product to integrate two magnetic components…
This article highlights PREMO Group launched the 3DPower™ as the first product to integrate two magnetic components that share the same core.
Wide bandgap GaN and SiC devices are expected to experience high levels of growth in applications ranging from power…
Wide bandgap GaN and SiC devices are expected to experience high levels of growth in applications ranging from power conversion to RF transistors…
Power Integrations announces the release of its BridgeSwitch™ integrated half-bridge (IHB) motor driver IC family.
Power Integrations announces the release of its BridgeSwitch™ integrated half-bridge (IHB) motor driver IC family.
The STGAP2DM gate driver integrates low-voltage control and interface circuitry with two isolated output channels that…
The STGAP2DM gate driver integrates low-voltage control and interface circuitry with two isolated output channels that allow either unipolar or…
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