This article focuses on the 2-level inverter and use this topology to exhibit the results
This article focuses on the 2-level inverter and use this topology to exhibit the results
The IPM technology offers an all-in-one solution including a 3-Phase water-cooled SiC MOSFET module with built-in gate drivers.
The IPM technology offers an all-in-one solution including a 3-Phase water-cooled SiC MOSFET module with built-in gate drivers.
Dr. Andy Mackie, Senior Product Manager of Semiconductor and Advanced Assembly Materials at Indium Corporation talks…
Dr. Andy Mackie, Senior Product Manager of Semiconductor and Advanced Assembly Materials at Indium Corporation talks about the company as a premier…
Exagan’s expertise will broaden and accelerate ST’s power GaN roadmap and business for automotive, industrial, and…
Exagan’s expertise will broaden and accelerate ST’s power GaN roadmap and business for automotive, industrial, and consumer applications.
Maxim Integrated’s healthcare unit looks to make wearables more powerful and medically useful for consumers.
Maxim Integrated’s healthcare unit looks to make wearables more powerful and medically useful for consumers.
The SLIMDIP™ family is the newest through-hole IPM, which offers reduced space and an optimized pin layout.
The SLIMDIP™ family is the newest through-hole IPM, which offers reduced space and an optimized pin layout.
These new gate-drivers are perfectly are best used in high-reliability applications such as HVDC VSC, STATCOM/FACTS, and…
These new gate-drivers are perfectly are best used in high-reliability applications such as HVDC VSC, STATCOM/FACTS, and medium-voltage drives.
The merger helps complete the financing to advance Transphorm's GaN power conversion business.
The merger helps complete the financing to advance Transphorm's GaN power conversion business.
Coronavirus' (COVID-19) spread threatens power electronics stocks, manufacturing, and worldwide conference travel.
Coronavirus' (COVID-19) spread threatens power electronics stocks, manufacturing, and worldwide conference travel.
This article provides an overview of the versatile combinations of chipsets and packaging and the resulting performance.
This article provides an overview of the versatile combinations of chipsets and packaging and the resulting performance.
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