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Microsemi Elected to Lead ‘ELCOSINT’ Team to Develop Material for High-Temperature Electronics

Microsemi Elected to Lead ‘ELCOSINT’ Team to Develop Material for High-Temperature Electronics

News Feb 25, 2013 by Jeff Shepard
Henkel Electronic Materials and Infineon Jointly-Develop Advanced Thermal-Interface Paste for Modules

Henkel Electronic Materials and Infineon Jointly-Develop Advanced Thermal-Interface Paste for Modules

News Feb 13, 2013 by Jeff Shepard
High-Power Resistor Offers up to 12.5W with No Heat Sink or Air Movement Required

High-Power Resistor Offers up to 12.5W with No Heat Sink or Air Movement Required

new products Feb 13, 2013 by Jeff Shepard
Laird Acquires Nextreme Thermal Solutions Technology

Laird Acquires Nextreme Thermal Solutions Technology

News Feb 12, 2013 by Jeff Shepard
High-Accuracy, Low-Power Digital Temperature Sensor Introduced

High-Accuracy, Low-Power Digital Temperature Sensor Introduced

new products Feb 06, 2013 by Jeff Shepard
Microsemi Expands SiC Power Module Product Family in Industrial and Extended Temperature Ranges

Microsemi Expands SiC Power Module Product Family in Industrial and Extended Temperature Ranges

new products Jan 14, 2013 by Jeff Shepard
Fairchild’s Dual Cool™ Package Improves Power Density and Performance in DC-DCs

Fairchild’s Dual Cool™ Package Improves Power Density and Performance in DC-DCs

new products Jan 07, 2013 by Jeff Shepard
50 Most-Read Power Electronics Stories of 2012: 30 to 21

50 Most-Read Power Electronics Stories of 2012: 30 to 21

News Dec 27, 2012 by Power Pulse1595211359
LED-Lighting Driver Design from Power Integrations Delivers Long Lifetime and High Efficiency

LED-Lighting Driver Design from Power Integrations Delivers Long Lifetime and High Efficiency

News Dec 18, 2012 by Jeff Shepard
Laird Technologies Publishes Thin Film Thermoelectric Handbook

Laird Technologies Publishes Thin Film Thermoelectric Handbook

News Dec 05, 2012 by Jeff Shepard
Mitsubishi Heavy Industries and Hitachi to Integrate Thermal Power Generation Businesses including Fuel Cells

Mitsubishi Heavy Industries and Hitachi to Integrate Thermal Power Generation Businesses including Fuel Cells

News Nov 29, 2012 by Jeff Shepard
Researchers Test Novel Power System for Space Travel

Researchers Test Novel Power System for Space Travel

News Nov 26, 2012 by Jeff Shepard
Toshiba Introduces New Line of High-Temperature Photocouplers

Toshiba Introduces New Line of High-Temperature Photocouplers

new products Nov 14, 2012 by Jeff Shepard
Advanced DC-DC Converters, Thermal Management Solutions and Tantalum-Poly SMD Caps Intro’d at Electronica

Advanced DC-DC Converters, Thermal Management Solutions and Tantalum-Poly SMD Caps Intro’d at Electronica

new products Nov 13, 2012 by Power Pulse1595211359
TI LED Driver Features Frequency Synchronization, PWM Dimming and Thermal Foldback

TI LED Driver Features Frequency Synchronization, PWM Dimming and Thermal Foldback

new products Oct 29, 2012 by Jeff Shepard
TI 2.5-A Isolated Gate Driver Doubles Device Lifetime, Extends Temperature Range

TI 2.5-A Isolated Gate Driver Doubles Device Lifetime, Extends Temperature Range

new products Oct 01, 2012 by Jeff Shepard
TriQuint Seeks Threefold GaN Power Handling Boost

TriQuint Seeks Threefold GaN Power Handling Boost

News Sep 26, 2012 by Jeff Shepard
Chomerics Addresses Automotive, Telecom and Aerospace Shielding and Thermal Challenges at electronica 2012

Chomerics Addresses Automotive, Telecom and Aerospace Shielding and Thermal Challenges at electronica 2012

News Sep 17, 2012 by Jeff Shepard
Albeo Advances LED Fixture Patent Strategy with Chip-in-Fixture Platform

Albeo Advances LED Fixture Patent Strategy with Chip-in-Fixture Platform

News Aug 09, 2012 by Jeff Shepard
XP Power Introduces Convection Cooled 60W DC-DC Converters

XP Power Introduces Convection Cooled 60W DC-DC Converters

new products Jul 25, 2012 by Jeff Shepard