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Kyocera Develops 1206-Size, 100V / 4.7uF MLCC with Maximum Operating Temperature of 125°C

Kyocera Develops 1206-Size, 100V / 4.7uF MLCC with Maximum Operating Temperature of 125°C

new products Apr 14, 2013 by Jeff Shepard
GE’s High-Temperature Superconductors Targeted for Next-Gen of Power Generation

GE’s High-Temperature Superconductors Targeted for Next-Gen of Power Generation

News Apr 03, 2013 by Jeff Shepard
New MLCCs are Targeted for High-Current, High-Power, & High-Temperature Applications

New MLCCs are Targeted for High-Current, High-Power, & High-Temperature Applications

new products Mar 31, 2013 by Jeff Shepard
FCI Power Distribution Systems Offer Space Savings, Lower Costs and Pluggable Modularity

FCI Power Distribution Systems Offer Space Savings, Lower Costs and Pluggable Modularity

new products Mar 25, 2013 by Jeff Shepard
Surge-Gard InRush Current Limiting NTC Thermistors Reduce Circuit Failures

Surge-Gard InRush Current Limiting NTC Thermistors Reduce Circuit Failures

new products Mar 14, 2013 by Jeff Shepard
Docea Enables Dynamic Power and Thermal Management Analysis with Real Use Cases

Docea Enables Dynamic Power and Thermal Management Analysis with Real Use Cases

new products Mar 13, 2013 by Jeff Shepard
Acquisition of NS Micro Motor Adds Fans and Blowers to Aavid’s Product Offering

Acquisition of NS Micro Motor Adds Fans and Blowers to Aavid’s Product Offering

News Mar 11, 2013 by Jeff Shepard
10A / 1200V SiC Schottky Rectifier Improves High-Temperature Performance

10A / 1200V SiC Schottky Rectifier Improves High-Temperature Performance

new products Mar 11, 2013 by Jeff Shepard
Microsemi Elected to Lead ‘ELCOSINT’ Team to Develop Material for High-Temperature Electronics

Microsemi Elected to Lead ‘ELCOSINT’ Team to Develop Material for High-Temperature Electronics

News Feb 25, 2013 by Jeff Shepard
Henkel Electronic Materials and Infineon Jointly-Develop Advanced Thermal-Interface Paste for Modules

Henkel Electronic Materials and Infineon Jointly-Develop Advanced Thermal-Interface Paste for Modules

News Feb 13, 2013 by Jeff Shepard
High-Power Resistor Offers up to 12.5W with No Heat Sink or Air Movement Required

High-Power Resistor Offers up to 12.5W with No Heat Sink or Air Movement Required

new products Feb 13, 2013 by Jeff Shepard
Laird Acquires Nextreme Thermal Solutions Technology

Laird Acquires Nextreme Thermal Solutions Technology

News Feb 12, 2013 by Jeff Shepard
High-Accuracy, Low-Power Digital Temperature Sensor Introduced

High-Accuracy, Low-Power Digital Temperature Sensor Introduced

new products Feb 06, 2013 by Jeff Shepard
Microsemi Expands SiC Power Module Product Family in Industrial and Extended Temperature Ranges

Microsemi Expands SiC Power Module Product Family in Industrial and Extended Temperature Ranges

new products Jan 14, 2013 by Jeff Shepard
Fairchild’s Dual Cool™ Package Improves Power Density and Performance in DC-DCs

Fairchild’s Dual Cool™ Package Improves Power Density and Performance in DC-DCs

new products Jan 07, 2013 by Jeff Shepard
50 Most-Read Power Electronics Stories of 2012: 30 to 21

50 Most-Read Power Electronics Stories of 2012: 30 to 21

News Dec 27, 2012 by Power Pulse1595211359
LED-Lighting Driver Design from Power Integrations Delivers Long Lifetime and High Efficiency

LED-Lighting Driver Design from Power Integrations Delivers Long Lifetime and High Efficiency

News Dec 18, 2012 by Jeff Shepard
Laird Technologies Publishes Thin Film Thermoelectric Handbook

Laird Technologies Publishes Thin Film Thermoelectric Handbook

News Dec 05, 2012 by Jeff Shepard
Mitsubishi Heavy Industries and Hitachi to Integrate Thermal Power Generation Businesses including Fuel Cells

Mitsubishi Heavy Industries and Hitachi to Integrate Thermal Power Generation Businesses including Fuel Cells

News Nov 29, 2012 by Jeff Shepard
Researchers Test Novel Power System for Space Travel

Researchers Test Novel Power System for Space Travel

News Nov 26, 2012 by Jeff Shepard