Microsemi Elected to Lead ‘ELCOSINT’ Team to Develop Material for High-Temperature Electronics

February 25, 2013 by Jeff Shepard

Microsemi Corporationhas been elected to lead the Electronic Component Sintered Interconnections (ELCOSINT) industry team in developing novel polymeric, sintered interconnection materials to replace high lead (Pb) content materials and further increase the operating temperature of electronic assemblies. These materials will be suitable for components subjected to extremely high operating temperatures of 250 degrees C or more, which often occur in market sectors such as aerospace and down hole drilling.

The three-year ELCOSINT project is partially funded by the Technology Strategy Board, an executive non-departmental public body established by the United Kingdom government to stimulate technology-enabled innovation. Microsemi will collaborate on the project with the UK's National Physical Laboratory, a world-leading center of excellence in developing and applying the most accurate measurement standards, science and technology available; and Gwent Electronic Materials Ltd., a supplier of sophisticated and cost-effective electronics materials.

The multi-disciplinary ELCOSINT project team will develop the materials and manufacturing process for electronic component interconnection using nano-silver based materials to form joints between components and substrates. The technology will be compatible with standard microelectronics manufacturing processes, and replacing high-lead solder with nano-silver based materials will enable improved performance in harsh environments. It is also more environmentally friendly.

A high temperature sensor amplifier demonstrator will be designed and produced that will allow the characterization, assessment and qualification of the developments to enable rapid production of reliable, robust electronic systems.