Laird Technologies Publishes Thin Film Thermoelectric Handbook

December 05, 2012 by Jeff Shepard

Laird Technologies, Inc. announced the publication of its "Thin Film Thermoelectric Handbook." The handbook was authored by the company's thermal management subject matter experts.

The handbook focuses on thin film thermoelectric modules (TFMs) and provides in-depth insight into the advantages of TFM's over traditional bulk technology, as well as the basic structure and function of TFMs, system level considerations required for device selection and thermal management design.

"The Thin Film Thermoelectric Handbook is a valuable tool that every design engineer should reference when specifying a TFM in an application." commented Andrew Dereka, Laird Technologies Product Manager. "This is a comprehensive tutorial that educates readers on the proper design and installation of thin film modules and helps to avoid common errors that can reduce operational life or limit output performance attributes of a module."

Designed for engineers with novice to intermediate thermoelectric experience, the handbook also covers Laird Technologies' eTECTM product line, design considerations, proper handling and assembly procedures, temperature sensing and mechanical integrity of the technology. As an industry leader in high-performance and cost-effective Thermal Management Solutions, Laird Technologies provides the knowledge, innovation, and resources to ensure exceptional thermal performance and customer satisfaction for applications in the medical, analytical, telecom, industrial, and consumer markets.