Infineon Technologies AG introduces the package technology TRENCHSTOP™ Advanced Isolation available for TRENCHSTOP and…
Infineon Technologies AG introduces the package technology TRENCHSTOP™ Advanced Isolation available for TRENCHSTOP and TRENCHSTOP Highspeed 3 IGBTs.
Artesyn Embedded Technologies today added 72 new models to its ERM family of dc-dc converter modules designed to meet the…
Artesyn Embedded Technologies today added 72 new models to its ERM family of dc-dc converter modules designed to meet the power demands and safety…
This article features the 7th generation IGBT Module based on SLC (SoLid Cover)-Technology with high reliability and high…
This article features the 7th generation IGBT Module based on SLC (SoLid Cover)-Technology with high reliability and high thermal conductivity.
This article discusses the optimization of heat sinks to be used in handheld devices particularly on heat sink spacing…
This article discusses the optimization of heat sinks to be used in handheld devices particularly on heat sink spacing and thickness.
This article highlights Vincotech GmbH the benefits of combining the lowinductiveVINco X12 package and the Mitsubishi gen…
This article highlights Vincotech GmbH the benefits of combining the lowinductiveVINco X12 package and the Mitsubishi gen 7 for outstanding…
AVX Corporation, a leading manufacturer and supplier of passive components and interconnect solutions, has doubled the…
AVX Corporation, a leading manufacturer and supplier of passive components and interconnect solutions, has doubled the lifetime of select THH…
This article features TDK's series of EPCOS components that are crucial to the reliability of fire alarm systems,…
This article features TDK's series of EPCOS components that are crucial to the reliability of fire alarm systems, particularly in overvoltage…
This article proposed and discussed the thermal and circuit benefits of a low rated power application without heat-sink…
This article proposed and discussed the thermal and circuit benefits of a low rated power application without heat-sink approach using 600V 4A…
Toshiba Electronics Europe has extended its range of high-efficiency U-MOS IX-H MOSFETs with an N-channel device in a…
Toshiba Electronics Europe has extended its range of high-efficiency U-MOS IX-H MOSFETs with an N-channel device in a ‘DSOP Advance’ SMD package
The VPG Foil Resistors announced the global market launch of the Powertron PCS Series
The VPG Foil Resistors announced the global market launch of the Powertron PCS Series
This article features the benefits of using SiC Power Modules in terms of energy conversion efficiency, cost-efficiency…
This article features the benefits of using SiC Power Modules in terms of energy conversion efficiency, cost-efficiency and environmental energy…
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