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Getting Innovative Power Electronics Designs to Market Faster and Easier Interview with Graham Maggs of Mouser Electronics

Getting Innovative Power Electronics Designs to Market Faster and Easier Interview with Graham Maggs of Mouser Electronics

In this interview, US correspondent for Bodo's Power, Henning Wriedt, speaks with Graham Maggs, VP Marketing for Europe at Mouser Electronics,…


Current Sensors Support 60Arms with >8mm of Creepage / Clearance Distance

Current Sensors Support 60Arms with >8mm of Creepage / Clearance Distance

Smallest Reinforced Isolated CAN FD Transceivers with Highest Bus Fault Protection

Smallest Reinforced Isolated CAN FD Transceivers with Highest Bus Fault Protection

3-A / 40-V QPL Schottky Diode for Military and Aerospace Markets

3-A / 40-V QPL Schottky Diode for Military and Aerospace Markets

IGBT Modules Rated for 6.5kV/1,000A, 4.5kV/1,500A and 3.3kV/1,800A

IGBT Modules Rated for 6.5kV/1,000A, 4.5kV/1,500A and 3.3kV/1,800A

Smallest, Highly Efficient Isolated RS-485 Module for Industry 4.0

Smallest, Highly Efficient Isolated RS-485 Module for Industry 4.0

Low-Profile Common Mode Choke for CAN or CAN FD Systems

Low-Profile Common Mode Choke for CAN or CAN FD Systems

Modern Electric Motor Technology and Applications

Modern Electric Motor Technology and Applications

This article features Alpha and Omega Semiconductor dual-in-line SMD-type intelligent power module (IPM) specialized for low-power BLDC motor-drive…


MCUs Use as Little as 28µA/MHz for Smaller, Longer-Lasting Smart Devices

MCUs Use as Little as 28µA/MHz for Smaller, Longer-Lasting Smart Devices

Expandable and Integrated Bluetooth 5 IC is AEC-Q100 Qualified

Expandable and Integrated Bluetooth 5 IC is AEC-Q100 Qualified

Industrial-Grade Processors offer Enhanced Security and Functional Safety Features

Industrial-Grade Processors offer Enhanced Security and Functional Safety Features

GaN Systems Launches New Products and Provides GaN Design Expertise at Chinas PEAC Power Conference

GaN Systems Launches New Products and Provides GaN Design Expertise at Chinas PEAC Power Conference

GaN Systems recently announced the details of its participation at the IEEE International Power Electronics and Application Conference and…


new products Oct 30, 2018 by GaN Systems
Ultra-Low Power Programmable Logic Devices for Wearables and Mobile Devices

Ultra-Low Power Programmable Logic Devices for Wearables and Mobile Devices

Ready-to-Use, 600-V GaN FET Power Stages Supports up to 10kW

Ready-to-Use, 600-V GaN FET Power Stages Supports up to 10kW

High Power Factor Single/Dual-Channel Linear LED Driver

High Power Factor Single/Dual-Channel Linear LED Driver

Microcontrollers Support DDS-XRCE Communication Protocol for ROS 2

Microcontrollers Support DDS-XRCE Communication Protocol for ROS 2

Lab Develops World’s First 3D Volumetric Circuit with Automated 3D Printing

Lab Develops World’s First 3D Volumetric Circuit with Automated 3D Printing


News Oct 27, 2018 by Paul Shepard
AEC-Q200 Compliant, Class X2-Rated Film Capacitors

AEC-Q200 Compliant, Class X2-Rated Film Capacitors

AI Chip Claims Dramatic Advantages in Latency and Power-Efficiency

AI Chip Claims Dramatic Advantages in Latency and Power-Efficiency

Gen-Three 32-Bit MCUs Claim Highest Embedded Processing Performance and Power Efficiency

Gen-Three 32-Bit MCUs Claim Highest Embedded Processing Performance and Power Efficiency