TSI Completes Spin-Off of Power Management Devices

September 02, 2014 by Jeff Shepard

TSI Semiconductors, Inc. has completed its spin-off of TSI's Products Division. The new independent company, TF Semiconductor Solutions, Inc. (TF Semi), will focus on the power management market where its 750V high-voltage process has already won designs with domestic and international customers. TF Semi will focus on LED drivers, LVDS interface devices, and JTAG system testing solutions and other power management devices. Leveraging global design teams and an extensive intellectual property (IP) technology portfolio, TF Semi is able to provide their valuable customers with complete system solutions focused on industrial, consumer, communications, computing, and automotive markets.

“TSI’s Board of Directors concluded that a spin-off of the Products Group at this stage is a strategic win for both entities as it will allow each to focus on their core businesses successfully. Both will be global leaders in their respective markets,” said Sagar Pushpala CEO of TSI Semiconductors’.

The new company will be led by industry veteran and former TSI Semiconductors COO, Roger Lee. “This is a great opportunity to capture a share of the fast growing international Green-Power market,” said Roger Lee, CEO and President of TF Semiconductor Solutions. “We are uniquely positioned as a lean and flexible start-up, with market ready products, a strong customer base, and global sales channels due to significant product and IP R&D investment over the last several years. It is a great foundation for this new venture.” Roger continued.

TSI Semiconductors will continue to operate as is a specialty analog and mixed-signal foundry with ISO, Automotive and Industrial Class Certifications and offers state-of-the-art contract semiconductor foundry services at its world-class manufacturing location in Roseville, California. At its 8-inch fabrication plant in Roseville, Ca, TSI can manufacture products in a large array of versatile processes that include analog/mixed-signal, deep-submicron, high-voltage BCDMOS, and emerging-market solutions, using traditional and novel materials, structures and devices.