TriQuint and Amkor Team on Flip-Chip Processes

TriQuint Semiconductor Inc. (Hillsboro, OR) announced that it is collaborating with Amkor Technology Inc. to commercialize a low-cost, flip-chip, assembly process for GaAs semiconductors based on TriQuint's CuFlip bumping technology.

Using CuFlip copper bumps, electrical connections are possible by directly linking contact points on a semiconductor die to the module ceramic or laminate substrate. The process has already been introduced in the ultra-small, 6mm x 6mm, TQM 7M4009 GSM power amplifier module (PAM). The interconnect capability of the CuFlip copper bumps allowed for a 40% size reduction in the GSM PAM and improved RF performance compared to its predecessor, according to the company.

"Amkor has been an excellent partner in the development of our CuFlip assembly process," said Ron Ruebusch, TriQuint's vice president for its Oregon operations. "Their extensive expertise in flip-chip assembly and process development has helped us meet our performance and scheduled requirements. Amkor provides us with high-volume production capacity to ramp-up CuFlip-based products quickly."