TI Adds Virtual Booth with APEC 2020 VideosMarch 26, 2020 by Paul Shepard
Texas Instruments has launched a virtual trade show booth with extensive information that was originally developed for the now cancelled 2020 IEEE Applied Power Electronics Conference (APEC 2020). You can watch demo videos and learn about new products that help solve your power design problems.
The virtual booth includes a review of recent product announcements and special focus sections on Industrial and Automotive designs and products. From wireless battery management to improved safety and reliability, you will see how TI is solving the automotive power design problems of today and tomorrow. And from improved thermal performance to smaller power supply solution size and better isolation, you can see how the company is solving tough power design challenges of today and tomorrow for a range of industrial, enterprise and comms applications.
Product announcements include:
Efficient buck converter for high-current designs
- Shrink the power supply while optimizing thermal performance, improve efficiency at high switching frequencies and meet rigorous voltage accuracy requirements for FPGA power supplies with the TPS546D24A, 40-A stackable SWIFT™ dc-dc buck converter.
900-V GaN solution for grid and beyond
- This new design, based on the LMG3410R050, is a GaN-based 99% efficient bi-directional ac-dc converter, that is 3x higher power density than Si and 1.5x higher than SiC.
Isolated power transfer in an IC-sized package
- Miniaturize your isolated dc-dc design up to 80% with the UCC12050 bias power supply, an IC-sized, single-package, surface-mount device with industry-leading EMI performance.
Video coverage includes:
- Overview video
- TPS546D24A stackable converter with integrated PMBus
- LMG3410R050 GaN FET with integrated driver
- UCC12050 dc-dc bias supply with integrated transformer
- LM5156-Q1 with DRSS dithering scheme to reduce EMI
- SimpleLink™ CC2642R-Q1 wireless MCU
- F28379D C2000™ real-time MCU controlCARD EVM