While the technical program for the 2016 IEEE International Electron Devices Meeting (IEDM) will be put together in the fall, many of the scheduled events are set, including the Special Focus Sessions, Tutorials and Short Courses. Power electronics will be a key focus again this year, ranging from system-level considerations to the latest developments in new materials such as GaN.
Special Focus Sessions will include: System-Level Impact of Power Devices –While there are forums that serve circuit experts for the exchange of ideas and the reporting of breakthroughs, there hasn’t been a suitable forum for bringing device and circuit experts together to consider impacts at the system level, even though that would be fruitful due to the interactions of circuits and devices. IEDM aims to serve as the forum for their dialogue, and so this Special Focus Session has been organized. Papers are expected to explore the system-level impact of power devices, and also to describe various types of power devices targeting the full range of power/power conversion applications such as hybrid vehicles, utility and grid control, computing/telecom power supplies, motor drives, and wireless power transfer.
A second Special Focus Session will look at Wearable Electronics and Internet of Things (IoT) – Wearable technology offers great promise for communications, fitness tracking, health monitoring, speech therapy, elder care/assisted living and many other applications. This Special Focus Session has been organized to benchmark wearable electronics technologies, to address applications with comprehensive system demonstrations, and to learn industrial perspectives about the gaps, challenges and opportunities for wider uses of wearable and IoT technologies. Papers on flexible/stretchable electronics, MEMs, display devices, sensors, printed electronics, organic devices and 2-D material devices enabling wearables/IoT devices also will be featured.
A program of 90-minute tutorial sessions on emerging technologies will be presented by experts in the fields, to bridge the gap between textbook-level knowledge and leading-edge current research. Advance registration is recommended. One of these tutorials will focus on Technologies for IoT and Wearable Applications, Including Advances in Cost-Effective and Reliable Embedded Non-Volatile Memories, Dr. Ali Keshavarzi, Vice President of R&D, Cypress Semiconductor -- This tutorial will cover a range of technology opportunities for IoT and wearable applications, including embedded non-volatile memories (eNVM), IPs and integrated solutions based on charge-trap memory technologies such as SONOS for low power (LP) and ultra-low-power (ULP) for advanced technology nodes. Technologies will be described for various integrated IoT, wearable and energy-harvesting systems using programmable systems-on-chips (SoCs) with digital and analog capabilities, along with low-energy Bluetooth radio, WiFi radio, solar cells, sensors, actuators, and power management ICs. Advanced small form-factor packaging technologies useful for system integration also will be described.
In addition, there will be Short Courses that provide the opportunity to learn about important areas and developments, and to benefit from direct contact with world experts. Advance registration is recommended. The short course on Design/Technology Enablers for Computing Applications, organized by John Chen, Vice President of Technology and Foundry Management, NVIDIA, will include information on GaN power devices – This course will describe how various design techniques and process technologies can enable computing applications, beginning with the relative advantages and disadvantages of processors such as CPU, GPU and FPGA with regard to today’s high data demands. It then will cover how memory becomes a bottleneck, and will discuss various emerging memory technologies to mitigate the problem. Because managing power dissipation has become critical, it also will offer a broad perspective on power efficiency in computing and how interconnect plays a pivotal role in both performance and energy efficiency. Finally, 2.5-D and 3-D advanced packaging technology is discussed for system integration. The course consists of lectures from five distinguished speakers:
The Rise of Massively Parallel Processing: Why the Demands of Big Data and Power Efficiency are Changing the Computing Landscape, Liam Madden, Corporate VP, Hardware & Systems Development, Xilinx, USA
Breaking the Memory Bottleneck in Computing Applications with Emerging Memory Technologies: a Design and Technology Perspective, Gabriel Molas, PhD Engineer, Leti, France
Power Management with Integrated Power Devices…and how GaN Changes the Story, Alberto Doronzo, Power System/Apps Engineer, Texas Instruments, USA
Interconnect Challenges for Future Computing, William J. Dally, Chief Scientist and Sr. VP of Research, NVIDIA, and Stanford Professor, USA
Advanced Packaging Technologies for System Integration, Douglas Yu, Sr. Director, TSMC, Taiwan
