ODU GmbH & Co. KG will again be showing its convincing implementation skills at this year's electronica (Munich, 11 to 14 November). In addition to its established connector solutions for medical technology, industrial electronics, measurement and testing technology, military and security technology, energy technology and automotive technology, the company will also be presenting a new product family in the area of miniaturization (HD = High Density). With diameters from 9.9 to 18.5 millimeters and contact densities of up to 40 contacts, the miniature connectors are now already showing that functionality and premium quality can fit into a compact space. At the same time, these featherweights guarantee a highly robust connection, convenient handling and a long service life.
The ODU experts are naturally also developing customized versions of the miniature connectors to meet specific customer requirements, and the company additionally offers assembly and cable extrusion as a system solution. Interested visitors to the trade fair can see the capability of the ODU connector solutions for themselves in Hall B3, Booth 143. The new AMC High-Density products were initially ODU's response to the demand from the military and security technology sector in Europe and the USA.
In the second step, the company from Mühldorf am Inn, Germany will be offering high density connection solutions in other markets, such as medical technology, sensor systems and communication technology, and consequently ensuring "A perfect alliance" around the world.
