Fairchild Announces New Korea Packaging Center

September 17, 2002 by Jeff Shepard

Fairchild Semiconductor International (South Portland, ME) announced the opening of a Package and Technology Knowledge Center to be based in Bucheon, South Korea. The center will research new packaging materials to improve thermal and mechanical performance and develop new assembly techniques.

"Bucheon has a world-class design and manufacturing facility for Fairchild, making it an ideal location for our Packaging and Technology Knowledge Center," said Don Desbiens, vice president of technology development at Fairchild Semiconductor.