News

Evergreen Solar Unveils Thin Wafer Breakthrough

December 06, 2004 by Jeff Shepard

Evergreen Solar Inc. (Marlboro, MA), a developer, marketer and manufacturer of photovoltaic products, announced a major advance in the development of its String Ribbon™ manufacturing process that has the potential to produce silicon wafers thinner than 150 microns. The company has filed a patent application for its thin wafer technology.

"With the latest enhancement to our Gemini II double ribbon growth process, Evergreen Solar has demonstrated in its pilot operations that it can manufacture wafers using one third of the silicon required by conventional methods - significantly reducing the overall cost of producing solar panels," said President and Chief Executive Officer Richard Feldt. "The ability to produce the thinnest wafers in the solar industry affords our company with a decided competitive advantage that no other company has demonstrated. This breakthrough demonstrates the robustness of our String Ribbon manufacturing process."