Diodes Licenses Powermite 3 Packaging Technology from Microsemi

September 05, 1999 by Jeff Shepard

Microsemi Corp. (Irvine, CA) announced that it has licensed Diodes Inc. (Westlake Village, CA) to manufacture and market discrete semiconductor devices using Microsemi's patented Powermite 3 surface-mount package.

Under the terms of the license, Diodes will manufacture devices having Microsemi's three-terminal Powermite packaging at its facilities in mainland China. By providing a second source for Powermite 3 products, Microsemi expects to accelerate industry acceptance of its packaging technology, while allowing Diodes to expand its portfolio of diode, rectifier and protection devices.

Microsemi will receive a royalty for Powermite 3 products sold by Diodes, as well as rights to purchase products manufactured at Diodes' mainland China facility. An initial packaging order was placed with Microsemi totaling approximately $1.0 million to start production of the new Schottky diodes and ultra-fast rectifiers in Powermite packages to be offered by Diodes.

"Microsemi looks to work with partners capable of helping us capitalize on the unique strengths of our patented Powermite packaging," said Manuel Lynch, vice president of marketing and business development at Microsemi. "This agreement will allow us to leverage Diodes' manufacturing excellence, strong customer service reputation and diverse customer base to further serve the numerous commercial applications that exist for our advanced technology."